5W thermal epoxy. Single-component, no pot-life limits. Low-viscosity flowable, thixotropic across structural geometries. Multi-reflow compatible, 13 ppm ultra-low CTE, high bond strength margin.
Long-term 400°C+ potting. 2.5 W/m·K thermal, insulating, acid/alkali/solvent resistant, dense fill, boil-proof with no delamination, zero high-temp outgassing.
SC66 series single-component conductive silver epoxy. High die-shear strength, high-Tg for aging resistance, chip-grade. Multiple thermal conductivity grades, ultra-low resistivity, low-CTE. Dispensable & printable.
Chip-grade underfill. CTE <25 ppm, low shrinkage, multiple Tg grades (>150°C). Single-component, fast heat-cure, reworkable. SIP/CSP/Flip-chip compatible. Multiple viscosity/flow/color/temp variants.
Single-component, ready-to-use. Heat-cure for high-strength bonding, 84D hardness, shock-resistant, insulating, withstands multiple reflow cycles. Dispensable & printable.
Cryogenic epoxy. −255°C no interfacial cracking, 180°C high-temp. Thermal, vibration/flex resistant, multi-aging pass. Medium viscosity, wide substrate compatibility, chemical/thermal-cycle resistant.
1000°C conductive silver. Two-component, heat-cure. Anti-aging, thermal-cycle resistant, 0.00004 Ω·cm. Bonds ceramic, glass, metal. Acid/alkali/solvent resistant.
Anti-aging two-component epoxy series. All −55°C Mil-Std compliant, 280°C, solvent resistant, high peel strength. Multiple grades for complex cycling conditions.
SC6218 20W thermal epoxy. Tg 195°C, 190°C/1800h aging zero decay. CTE 28 ppm, 22 MPa bond. Single-component, heat-cure. Bonds metal/ceramic/glass/plating.
Long-term 500–1000°C. Multi-viscosity. Anti-aging, thermal-cycling resistant, insulating, low-CTE. Zero outgassing, acid/alkali 24h+ resistant.
SC618 500°C conductive. Single-component, 30 MPa bond, zero outgassing at temp. Bonds metal/ceramic/glass. Acid/alkali/solvent resistant. RT storage, no cold chain.
SC3960 cryogenic epoxy. −70°C no cracking, Mil-Std pass. 180°C high-temp, 1.5 W/m·K thermal. 96D hardness: 200 MPa compressive, 120 MPa flexural. Bonds military & automotive-grade parts.
Core parameters across temperature·viscosity·shear strength·application for cross-selection decisions
| Model | Temperature | Viscosity | Shear Strength | Application |
|---|---|---|---|---|
| SC6112 | −40 °C–280 °C | 15000 mPa·s | 32 MPa | Semi · Compute Chips |
| SC633 | −40 °C–600 °C | 3000 mPa·s | 5 MPa (400 °C) | Semi Process · Wafers |
| SC6616 | −40 °C–300 °C | 8000–30000 mPa·s | 16 MPa (Au-plated) | Semiconductor · Pkg |
| SC6707 | −40 °C–280 °C | 600–5000 mPa·s | 16 MPa / Reworkable | Advanced Pkg · Underfill |
| SC6300 | −40 °C–300 °C | 280000 mPa·s | 29 MPa (Si chip) | Sensors · Semi Process |
| SC673 | −255 °C–180 °C | 40000 mPa·s | 16 MPa (−255 °C) | Quantum · Cryo Sensors |
| SC616 | −45 °C–1000 °C | 25000 mPa·s | 5 MPa | Semi Process · Aerospace |
| SC626 | −55 °C–280 °C | 8000–80000 mPa·s | 28 MPa | Military · Mil-Spec |