High‑Reliability Molecular Formulation Matrix for Precision Packaging
Products shown represent baseline technical anchors only. Backed by an extensive formulation library, SCITEO initiates molecular-level custom development engineered to your specifications.
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Quick Technical Comparison
Core parameters across temperature·viscosity·shear strength·application for cross-selection decisions
| Model | Temperature | Viscosity | Shear Strength | Application |
|---|---|---|---|---|
| SC6112 | -40 °C - 280 °C | 15000 mPa·s | 32 MPa | Semi · Compute Chips |
| SC633 | -40 °C - 600 °C | 3000 mPa·s | 5 MPa (400 °C) | Semi Process · Wafers |
| SC6616 | -40 °C - 300 °C | 8000-30000 mPa·s | 16 MPa 镀金层 | Semiconductor · Pkg |
| SC6707 | -40 °C - 280 °C | 600-5000 mPa·s | 16 MPa / Reworkable | Advanced Pkg · Underfill |
| SC6300 | -40 °C - 300 °C | 280,000 mPa·s | 26 MPa硅芯片 | Sensors · Semi Process |
| SC673 | -255 °C - 180 °C | 40000 mPa·s | -255 °C 16 MPa | Quantum · Cryo Sensors |
| SC616 | -45 °C - 1000 °C | 25000 mPa·s | 5 MPa | Semi Process · Aerospace |
| SC626 | -55 °C - 280 °C | 8000-80000 mPa·s | 28 MPa | Military · Mil-Spec |