SCITEO Products | High-Temp·Thermal·Conductive Adhesives

Ultra-Low CTE

SC6112 5 W Thermal Epoxy — High-Strength, Single-Component, Insulating, Low-CTE 13 ppm, Anti-Aging

Photonic Quantum Chip Packaging, IGBT Module Thermal Packaging, High-Power Module Heat Transfer

Shear Strength: 32 MPa (etched Al)
Temperature Range: −40 °C–280 °C

400 °C+ Long-Term

SC633 Long-Term 400 °C Potting Compound — Thermal, Insulating, Acid/Alkali-Resistant, Single-Component

Military Connector Potting, Ceramic Sensor Filling, Military Sensor Potting

Thermal Conductivity: 2.5 W/m·K
Temperature Range: −40 °C–600 °C

High-Strength Die Shear

SC6616 Die-Attach Conductive Silver — High-Strength, High-Tg, Low Resistivity, Thermal-Cure Epoxy

Quantum Chip Packaging, Wafer-Level Chip Bonding, MEMS Sensor Bonding

Shear Strength: 19 MPa (Au-plated)
Tg: 110–195 °C

Low-CTE · High-Tg

SC6707 Chip-Package Underfill Epoxy — Low-CTE, High-Tg, High-Modulus for Advanced Packaging

Optoelectronic Co-Packaging, High-Speed Chip Dispensing, Flip-Chip Dispensing

CTE below Tg: 13–40 ppm/°C
Tg: 90–155 °C

300 °C High-Temp

SC6300 High-Temp 300 °C Single-Component Epoxy — Insulating, Thermal-Cure, High-Strength Bonding

Semiconductor Process Components, High-Temp Sensor Sealing, Optoelectronic Display Chips

Shear Strength: 29 MPa (Si chip)
Temperature Range: −40 °C–300 °C

20 W Thermal · High-Tg

SC6218 20 W Thermal Epoxy — High-Tg 195 °C, Long-Term Anti-Aging, High-Strength, Low-CTE 28 ppm

High-Power Chip Bonding, Military Laser Bonding, MEMS Chip Sensor Bonding

Shear Strength: 22 MPa
Temperature Range: −45 °C–280 °C

1000 °C Conductive

SC616 1000 °C Conductive Silver — Two-Component, Heat-Cure, Low Resistivity, Anti-Aging, High-Strength

Semiconductor Process, Semiconductor Equipment, Sensor Thermal Bonding

Shear Strength: 5 MPa
Temperature Range: −45 °C–1000 °C

Anti-Aging Wide-Temp

SC626 Anti-Aging Two-Component Epoxy — Wide-Temp Cycling, Chemical-Resistant, High Peel Strength Insulating Adhesive

Power Module Bonding, Heat-Dissipation Component Bonding, Military Component Bonding

Shear Strength: 32 MPa
Temperature Range: −55 °C–280 °C

4.5 W Thermal · High Bond

SC6114 4.5 W Thermal Epoxy — High-Strength, High-Temp, Single-Component Heat-Cure Rigid Adhesive

High-Power Chip Bonding, Thermal Component Bonding, Power Module Bonding

Viscosity @ 25 °C: 280000 mPa·s
Temperature Range: −45 °C–280 °C

500 °C+ Long-Term

SC610 Extreme-Temp 500 °C+ Adhesive — Low-CTE, Insulating, 1000 °C Peak Rigid Bonding & Sealing

Sensor Bonding, High-Temperature Limit Test, Military Equipment Sensors

Temperature Range: −45 °C–1000 °C
CTE below Tg: 7.1 ppm/°C

80 °C Low-Temp Conductive

SC6280 80 °C Low-Temp Cure Conductive Silver — Single-Component, High Bond, Low Resistivity

Conductive Wafer Bonding, Product & Packaging Display, Power Module Bonding

Shear Strength: 18 MPa
Tg: 120 °C

−70 °C Cryogenic · 96D

SC3960 −70 °C Cryogenic Epoxy — Thermal, High/Low-Temp Cycling, 96D Ultra-Hard, Potting & Bonding

Military Sensor Bonding, Automotive Parts Bonding, Military-Standard Component Potting

Shore Hardness: 96 Shore D
Temperature Range: −70 °C–180 °C

280 °C Thermal · Low-CTE

SC6002 280 °C Potting Epoxy — 2.5 W Thermal, Low-CTE, Insulating, 30 MPa, Two-Component

Sensor Potting and Filling, Power Module Potting, Automotive Parts Sealing

Shear Strength: 30 MPa (etched Al)
Temperature Range: −40 °C–280 °C

60 W Thermal · Low-CTE

SC6219 60 W Thermal+Conductive Epoxy — Single-Component, High Bond, Low-CTE, Low Resistivity

Semiconductor Die Attach, Military Laser Bonding, Optical Packaging

Shear Strength: 22 MPa
Temperature Range: −45 °C–280 °C

−255 °C Cryogenic

SC673 Cryogenic −255 °C Epoxy — High-Strength, Anti-Aging, Insulating, Thermal-Cycling Resistant

Cryogenic Sensor Sealing, Cryogenic Sensor Bonding, Quantum Computer Bonding

Shear Strength: 17 MPa (−255 °C)
Temperature Range: −255 °C–180 °C

Low-Temp Fast Cure

SC6106 Low-Temp Cure Epoxy — 60–80 °C Thermal Cure, Low Moisture Absorption, Single-Component Insulating

Camera Module Packaging, Optical Chip Packaging, FPC Chip Underfill

Viscosity @ 25 °C: 1500–280000 mPa·s
Temperature Range: −40 °C–240 °C

500 °C Conductive

SC618 500 °C Conductive Adhesive — Single-Component, Heat-Cure, High-Strength, Low-Resistance Bonding

Semiconductor Packaging, Ceramic Sensor Bonding, Semiconductor Process

Shear Strength: 30 MPa
Temperature Range: −45 °C–500 °C

300 °C Transparent

SC6630 300 °C Transparent Epoxy — Single-Component, High-Strength, Insulating, Rigid Bonding & Sealing

Semiconductor Die Attach, Wafer Bonding Process, Precision Bonding

Shear Strength: 22 MPa
Temperature Range: −40 °C–300 °C

Anti-Aging Sintered Silver

SC6900 Sintered Silver — Pressureless, Power Module, High-Temp, High-Strength, Low Resistivity, Anti-Aging

IGBT Die Attach, Power Module Bonding, Semiconductor Chip Bonding

Shear Strength: 26 MPa
Temperature Range: −45 °C–280 °C

85/85 1000 h Aging

SC6036 85/85 Anti-Aging Adhesive — 1000 h Humidity/Heat, Low Outgassing, Insulating, Bonding, Sealing

LiDAR Component Sealing, Automotive Chip Packaging, Military Sensor Sealing

Aging Resistance: 85/85 1000 h
Temperature Range: −45 °C–265 °C

RT-Cure Thermal Potting

SC6080 Thermal Potting Epoxy — High-Hardness, RT-Cure, Insulating, Low-Viscosity, Two-Component

Thermal Component Potting, Power Component Thermal Potting, Chip Module Thermal Potting

Shear Strength: 18 MPa
Temperature Range: −40 °C–180 °C

MEMS Thermal/Conductive/Insulating

SC6678 MEMS Sensor Packaging Adhesive — Insulating, Thermal, Conductive, Low-CTE, Bonding & Sealing

MEMS Chip Bonding, Thermal Sensor Sealing, Micro-Optical Sensor Sealing

Shear Strength: 28 MPa
Temperature Range: −55 °C–500 °C (selectable)

Residue-Free Removal

SC6301 Temporary Bonding Adhesive — Semiconductor-Grade, 280 °C PVD/CVD, Acid/Alkali pH1-13, Peel-Clean Removal

Wafer Fab Masking, Temporary PCBA Bonding, Wafer Fab Fixture Protection

Tensile Modulus: 2–14 MPa
Temperature Range: −45 °C–280 °C

Optical Chip High-Temp

SC6724 CMOS Sensor Epoxy — CIS Chip Package, High-Temp, Bonding, Sealing, Anti-Aging

Optical CIS Packaging, Lens Module CMOS Bonding, CIS Sensor Packaging

Shear Strength: 26 MPa
Temperature Range: −40 °C–280 °C

Black UV Light-Blocking

SC6046 Black UV-Cure Adhesive — Light-Blocking, Confidential Fill & Seal, Chip-Level Optical Adhesive

Semiconductor Packaging, Optical Component Packaging, Electronics Packaging

Shear Strength: 10 MPa
Temperature Range: −40 °C–120 °C

Anti-Aging Thermal PCM

SC6960 9 W High-Thermal Gel — Anti-Aging, Gap Fill, Sealing, Cryogenic, Insulating, Single-Component PCM

Power Module Heat Transfer, Sensor Heat Transfer, Data Center Heat Transfer

Aging Resistance: 85/85 1500 h
Temperature Range: −55 °C–250 °C

High-Clarity Flexible PU

SC609 Flexible High-Transparency PU — Two-Component, RT-Cure, High Elongation, Bonding, Sealing, Anti-Aging

FPC Component Bonding, Flexible Electronics Bonding, Automotive Chip Underfill

Shear Strength: 10 MPa
Temperature Range: −45 °C–150 °C

Single-Component Fast Cure

SC6360 Heat-Cure Silicone — Fast Full Cure, Single-Component, Bonding, Sealing, Insulating, Thermal

Semiconductor Bonding, Quantum Computer Bonding, Precision Bonding

Shear Strength: 6 MPa
Temperature Range: −55 °C–220 °C

Seconds-Cure UV

SC6020 UV-Cure Chip Packaging Adhesive — Semiconductor Bonding, Sealing, Fixation, Anti-Aging

Communication Module Bonding, Optical Lens-to-Glass Sealing, Chip Corner Bonding

Shear Strength: 15 MPa
Temperature Range: −20 °C–180 °C

Non-Cure · V0 FR

SC6920 8 W High-Thermal Gel — Non-Curing, Insulating, Low Thermal Resistance, Single-Component

Automotive Thermal Potting, Telecom Module Potting, Data Center Power Potting

Thermal Resistance: 0.04 °C/W
Temperature Range: −40 °C–240 °C

Mil-Std Wide Temp

SC2620 Military Connector Potting Epoxy — Wide-Temp, Mil-Std Cold/Heat Cycling, Flame-Retardant, Insulating

Data Center Harness Potting, Vehicle Connector Potting, Aerospace Connector Potting

Shear Strength: 26 MPa (Cu-plated)
Temperature Range: −55 °C–280 °C

Wide-Temp Crack-Free

SC6210 Ceramic Bonding Epoxy — 1000 °C, Thermal, Conductive, Potting, Sealing, Insulating

Ceramic Chip Bonding, Ceramic Semiconductor Bonding, Precision Bonding

Shear Strength: 20–32 MPa
Temperature Range: −40 °C–1000 °C

Sensor Wide-Temp

SC640 Sensor Sealant — Long-Term Wide-Temp, Thermal, Bonding, Potting, Anti-Aging, Insulating

High-Temp Sensor Sealing, Automotive Sensor Sealing, Military Sensor Sealing

Shear Strength: 26 MPa
Temperature Range: −45 °C–1000 °C

Dual UV+Thermal Cure

SC6390 UV+Thermal Dual-Cure Adhesive — Light/Heat Cure, Anti-Humidity Aging, Bonding, Sealing, Insulating

Semiconductor Die Attach, Optical Packaging, Image Sensor Sealing

Shear Strength: 16 MPa
Temperature Range: −40 °C–180 °C

Low-Viscosity Thermal Coating

SC9132 Insulating Conformal Coating — PCBA Wide-Temp, Anti-Aging, Chemical-Resistant, Fluorescent Protective Coating

PCBA Conformal Coating, Military Component Coating, Automotive Parts Coating

Shore Hardness: 60 Shore A–85 Shore D
Temperature Range: −60 °C–180 °C

90D Ultra-Hard Clear

SC6004 >90D Ultra-Hard Transparent Epoxy — Two-Component, Abrasion-Resistant, Flowable Optical Seal

Glass-Like Encapsulation, Liquid-State Demonstration, Optical Component Protection

Shore Hardness: >90 Shore D
Temperature Range: −20 °C–120 °C

High-Reliability Molecular Formulations for Precision Packaging

Foundational baselines shown. SCITEO maintains an unpublished repository of proprietary engineering grades across diverse operational envelopes