SC6616 Die-Attach Conductive Silver — High-Strength, High-Tg, Low Resistivity, Thermal-Cure Epoxy
SC66 series single-component conductive silver epoxy. High die-shear strength, high-Tg for aging resistance, chip-grade. Multiple thermal conductivity grades, ultra-low resistivity, low-CTE. Dispensable & printable. 2.6–5 GPa multi-grade tensile modulus. 500 thermal cycles (−40 to 125 °C): 84% shear retention; damp-heat 1000 h (85 °C / 85% RH): 70% shear retention.
Advanced semiconductors, advanced packaging, power modules and high-power components — bonding, sealing, thermal and electrical conduction.
- Shear Strength
- 19 MPa (Au-plated)
- Tg
- 110–195 °C
- Cure Condition
- 150 °C / 30 min
- Viscosity @ 25 °C
- 8000–30000 mPa·s
SCITEO Rigorous Standards: Qualified under GJB 150 environmental reliability testing by Zhenhua, CETC, and CAC, delivering mission-critical reliability.
Engineered as high-reliability domestic qualified alternatives for semiconductor and defense manufacturing clusters across Shanghai Zhangjiang, Xi'an, Chengdu, and Wuxi.
Specifications Don't Match Your Operating Conditions?
Only the baseline series is shown here. SCITEO's undisclosed archive holds formulations engineered for extreme environments. Contact us — our application engineers will match you precisely.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating conditions.
Quantum Chip Packaging
Wafer-Level Chip Bonding
MEMS Sensor Bonding
Application Engineer FAQ
A structured brief from SCITEO covering physical properties, application standards, and related specifications.
What substrates? Difference from consumer-grade conductive adhesives?
Bonds metal, silicon, glass, ceramic, and platings. The key difference versus consumer-grade adhesives is chip-grade ionic purity, low CTE, and high Tg, which suit far more demanding packaging conditions.
Conductive silver adhesive vs. silver paste?
Both are liquid conductive materials. Silver adhesive contains bonding resin — designed for bonding + conduction, dispensable & printable. Silver paste prioritizes conduction, typically print-only, with lower structural strength.
Request Technical Documentation or Consult an Application Engineer
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SC6900 Sintered Silver — Pressureless, Power Module, High-Temp, High-Strength, Low Resistivity, Anti-Aging
Sintered silver series. Pressured/pressureless, full/partial sinter variants. Ultra-low resistivity, high bond strength, multi-aging test pass. Up to 280 W/m·K thermal. 1000 thermal cycles (−40 to 125 °C): 98% shear retention; damp-heat storage 1000 h (85 °C / 85% RH): 90% shear retention.
SC6280 80 °C Low-Temp Cure Conductive Silver — Single-Component, High Bond, Low Resistivity
Conductive silver series. Single-component, low-temp cure, 60 °C minimum. High bond strength, chip-grade, 3.1–4.5 GPa tensile modulus. Dispensable & printable. 500 thermal cycles (−40 to 125 °C): 54% shear retention.