Precision Molecular Engineering
SC6616 Die-Attach Conductive Silver — High-Strength, High-Tg, Low Resistivity, Thermal-Cure Epoxy
SC66 series single-component conductive silver epoxy. High die-shear strength, high-Tg for aging resistance, chip-grade. Multiple thermal conductivity grades, ultra-low resistivity, low-CTE. Dispensable & printable.
Novel semiconductors, advanced packaging, power modules, high-power component bonding, sealing, thermal & electrical conduction.
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
Quantum chip packaging
Conductive silver adhesive for wafer bonding
Electrical conductivity of power sensor structures
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
What substrates? Difference from consumer-grade conductive adhesives?
Bonds metal, silicon, glass, ceramic, platings. Key difference: chip-grade ionic stability, low-CTE and high-Tg for complex operating conditions.
Conductive silver adhesive vs. silver paste?
Both are liquid conductive materials. Silver adhesive contains bonding resin — designed for bonding + conduction, dispensable & printable. Silver paste prioritizes conduction, typically print-only.
Request TDS or Consult Application Engineer
Receive full Technical Data Sheets (TDS), Safety Data Sheets (SDS), and customized formulations. Please provide accurate information for verification.
Recommended Advanced Materials
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SC6678 MEMS Sensor Packaging Adhesive — Insulating, Thermal, Conductive, Low-CTE, Bonding & Seal
MEMS sensor adhesive series. −55–500°C, 2–60W thermal, ultra-low resistivity conductive, insulating hermetic, 13 ppm low-CTE drift prevention. Multiple viscosity/thixotropy variants.
SC6900 Sintered Silver — Pressureless, Power Module, High-Temp, High-Strength, Low Resistivity, Anti-Aging
Sintered silver series. Pressured/pressureless, full/partial sinter variants. Ultra-low resistivity, high bond strength, multi-aging test pass. Up to 280 W/m·K thermal.
SC6280 80°C Low-Temp Cure Conductive Silver — Single-Component, High Bond, Low Resistivity
Conductive silver series. Single-component, low-temp cure, 60°C minimum. High bond strength, chip-grade. Dispensable & printable.