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SC6900 Sintered Silver — Pressureless, Power Module, High-Temp, High-Strength, Low Resistivity, Anti-Aging
SCITEO LAB TRUST100% Lab Tested
DISPENSING HARDWARENordson Syringe
OUTER PACKAGINGVacuum Packaging
PACKAGING10cc/syringe
Permeating the silicon matrix from the unseen

Precision Molecular Engineering

SC6900 Sintered Silver — Pressureless, Power Module, High-Temp, High-Strength, Low Resistivity, Anti-Aging

Sintered silver series. Pressured/pressureless, full/partial sinter variants. Ultra-low resistivity, high bond strength, multi-aging test pass. Up to 280 W/m·K thermal.

Typical Application

Novel semiconductors, power modules, advanced packaging — bonding, die-attach, thermal & conduction.

Technical Specifications
Shear Strength
26 MPa
Temperature Range
−45 °C–280 °C
Aging Resistance
85/85 1000 h
Thermal Conductivity
220–280 W/m·K
* Multiple specifications are available for this series.
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.

This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.

SCITEO R&D ARCHIVE

Specifications Don't Match Your Operating Conditions?

This page displays only the baseline product series. Within SCITEO's undisclosed database, we maintain extensive formulations engineered for extreme environments. Contact us directly — our application experts will deliver a precise match.

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APPLICATION FIELDS

High Reliability Scenarios

Core positioning and partial application demonstration of this product under complex operating cycles.

SCITEO sintered silver conductive adhesive for IGBT third-generation semiconductor bonding, die-attach, thermal and electrical conductance

IGBT Die Attach

SCITEO sintered silver conductive adhesive for power module bonding, die-attach, thermal and electrical conductance

Power Module Bonding

SCITEO sintered silver conductive adhesive for semiconductor chip bonding, die-attach, thermal and electrical conductance

Semiconductor Chip Bonding

FAQ & ENGINEERING ANSWERS

Application Engineer FAQ

SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.

Q

Pressured vs. pressureless sintering?

A

Pressured: 5–40 MPa mechanical pressure, lower temp cure, superior porosity/thermal/shear. Pressureless: better process compatibility and versatility.

Q

Anti-aging performance?

A

Exceptional shear strength and thermal stability: 260°C 2h heat aging 22 MPa, −45–155°C 500 cycles 21 MPa, 85/85 1000h 22 MPa.

SCITEO Application Engineering Support

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