SC6900 Sintered Silver — Pressureless, Power Module, High-Temp, High-Strength, Low Resistivity, Anti-Aging
QUALITY CONTROL100% Lab Tested
DISPENSING SPECNordson Syringe
OUTER PACKAGINGVacuum-Sealed
PACKAGING SPEC10cc/syringe
Permeating the silicon matrix from the unseen

SC6900 Sintered Silver — Pressureless, Power Module, High-Temp, High-Strength, Low Resistivity, Anti-Aging

Sintered silver series. Pressured/pressureless, full/partial sinter variants. Ultra-low resistivity, high bond strength, multi-aging test pass. Up to 280 W/m·K thermal. 1000 thermal cycles (−40 to 125 °C): 98% shear retention; damp-heat storage 1000 h (85 °C / 85% RH): 90% shear retention.

Typical Application

Advanced semiconductors, power modules and advanced packaging — bonding, interconnect, thermal and electrical conduction.

Technical Specifications
Shear Strength
26 MPa
Temperature Range
−45 °C–280 °C
Aging Resistance
85/85 1000 h
Thermal Conductivity
220–280 W/m·K
* Multiple specifications are available for this series
SCITEO Rigorous Standards: Qualified under GJB 150 environmental reliability testing by Zhenhua, CETC, and CAC, delivering mission-critical reliability.

Engineered as high-reliability domestic qualified alternatives for semiconductor and defense manufacturing clusters across Shanghai Zhangjiang, Xi'an, Chengdu, and Wuxi.

SCITEO R&D ARCHIVE

Specifications Don't Match Your Operating Conditions?

Only the baseline series is shown here. SCITEO's undisclosed archive holds formulations engineered for extreme environments. Contact us — our application engineers will match you precisely.

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APPLICATION FIELDS

High Reliability Scenarios

Core positioning and partial application demonstration of this product under complex operating conditions.

SCITEO sintered silver conductive adhesive for IGBT third-generation semiconductor bonding, die-attach, thermal and electrical conductance

IGBT Die Attach

SCITEO sintered silver conductive adhesive for power module bonding, die-attach, thermal and electrical conductance

Power Module Bonding

SCITEO sintered silver conductive adhesive for semiconductor chip bonding, die-attach, thermal and electrical conductance

Semiconductor Chip Bonding

FAQ & ENGINEERING ANSWERS

Application Engineer FAQ

A structured brief from SCITEO covering physical properties, application standards, and related specifications.

Q

Pressured vs. pressureless sintering?

A

Pressure-assisted sintering applies 5–40 MPa and lowers the sintering temperature, improving porosity, conduction, and shear strength; it is more demanding, whereas pressureless sintering offers broader compatibility.

Q

Anti-aging performance?

A

SC6900 passes multiple 1000-hour-class aging protocols: after 260 °C storage, −45 to 155 °C thermal cycling, and 85/85 damp-heat exposure, both shear strength and the thermal conduction path remain stable with no measurable drift.

Engineering Support

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