Precision Molecular Engineering
SC6900 Sintered Silver — Pressureless, Power Module, High-Temp, High-Strength, Low Resistivity, Anti-Aging
Sintered silver series. Pressured/pressureless, full/partial sinter variants. Ultra-low resistivity, high bond strength, multi-aging test pass. Up to 280 W/m·K thermal.
Novel semiconductors, power modules, advanced packaging — bonding, die-attach, thermal & conduction.
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
Advanced semiconductor bonding
Power electronic bonding
High power component bonding
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
Pressured vs. pressureless sintering?
Pressured: 5–40 MPa mechanical pressure, lower temp cure, superior porosity/thermal/shear. Pressureless: better process compatibility and versatility.
Anti-aging performance?
Exceptional shear & thermal: 260°C 2h heat aging 22 MPa, −45–155°C 500 cycles 21 MPa, 85/85 1000h 22 MPa.
Request TDS or Consult Application Engineer
Receive full Technical Data Sheets (TDS), Safety Data Sheets (SDS), and customized formulations. Please provide accurate information for verification.
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SC6616 Die-Attach Conductive Silver — High-Strength, High-Tg, Low Resistivity, Thermal-Cure Epoxy
SC66 series single-component conductive silver epoxy. High die-shear strength, high-Tg for aging resistance, chip-grade. Multiple thermal conductivity grades, ultra-low resistivity, low-CTE. Dispensable & printable.
SC618 500°C Conductive Adhesive — Single-Component, Heat-Cure, High-Strength, Low-Resistance Bonding
SC618 500°C conductive. Single-component, 30 MPa bond, zero outgassing at temp. Bonds metal/ceramic/glass. Acid/alkali/solvent resistant. RT storage, no cold chain.
SC616 1000°C Conductive Silver — 2K AB, Heat-Cure, Low Resistivity, Anti-Aging, High-Strength
1000°C conductive silver. 2K AB, heat-cure. Anti-aging, thermal-cycle resistant, 0.00004 Ω·cm. Bonds ceramic, glass, metal. Acid/alkali/solvent resistant.