
SC6900 Sintered Silver — Pressureless, Power Module, High-Temp, High-Strength, Low Resistivity, Anti-Aging
Sintered silver series. Pressured/pressureless, full/partial sinter variants. Ultra-low resistivity, high bond strength, multi-aging test pass. Up to 280 W/m·K thermal. 1000 thermal cycles (−40 to 125 °C): 98% shear retention; damp-heat storage 1000 h (85 °C / 85% RH): 90% shear retention.
Advanced semiconductors, power modules and advanced packaging — bonding, interconnect, thermal and electrical conduction.
- Shear Strength
- 26 MPa
- Temperature Range
- −45 °C–280 °C
- Aging Resistance
- 85/85 1000 h
- Thermal Conductivity
- 220–280 W/m·K
SCITEO Rigorous Standards: Qualified under GJB 150 environmental reliability testing by Zhenhua, CETC, and CAC, delivering mission-critical reliability.
Engineered as high-reliability domestic qualified alternatives for semiconductor and defense manufacturing clusters across Shanghai Zhangjiang, Xi'an, Chengdu, and Wuxi.
Specifications Don't Match Your Operating Conditions?
Only the baseline series is shown here. SCITEO's undisclosed archive holds formulations engineered for extreme environments. Contact us — our application engineers will match you precisely.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating conditions.

IGBT Die Attach

Power Module Bonding

Semiconductor Chip Bonding
Application Engineer FAQ
A structured brief from SCITEO covering physical properties, application standards, and related specifications.
Pressured vs. pressureless sintering?
Pressure-assisted sintering applies 5–40 MPa and lowers the sintering temperature, improving porosity, conduction, and shear strength; it is more demanding, whereas pressureless sintering offers broader compatibility.
Anti-aging performance?
SC6900 passes multiple 1000-hour-class aging protocols: after 260 °C storage, −45 to 155 °C thermal cycling, and 85/85 damp-heat exposure, both shear strength and the thermal conduction path remain stable with no measurable drift.
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SC66 series single-component conductive silver epoxy. High die-shear strength, high-Tg for aging resistance, chip-grade. Multiple thermal conductivity grades, ultra-low resistivity, low-CTE. Dispensable & printable. 2.6–5 GPa multi-grade tensile modulus. 500 thermal cycles (−40 to 125 °C): 84% shear retention; damp-heat 1000 h (85 °C / 85% RH): 70% shear retention.

SC618 500 °C Conductive Adhesive — Single-Component, Heat-Cure, High-Strength, Low-Resistance Bonding
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