Precision Molecular Engineering
SC618 500°C Conductive Adhesive — Single-Component, Heat-Cure, High-Strength, Low-Resistance Bonding
SC618 500°C conductive. Single-component, 30 MPa bond, zero outgassing at temp. Bonds metal/ceramic/glass. Acid/alkali/solvent resistant. RT storage, no cold chain.
High-power components, sensors, semiconductor fab — bonding, sealing, filling & conduction.
- Shear Strength
- 30 MPa
- Temperature Range
- −45 °C–500 °C
- Cure Condition
- 120 °C / 60 min
- Viscosity @ 25 °C
- 50000 mPa·s
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
Specifications Don't Match Your Operating Conditions?
This page displays only the baseline product series. Within SCITEO's undisclosed database, we maintain extensive formulations engineered for extreme environments. Contact us directly — our application experts will deliver a precise match.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
Semiconductor Packaging
Ceramic Sensor Bonding
Semiconductor Process
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
Does conductivity decay at 500°C?
No. SC618 rated 500°C but short-term withstands up to 1000°C under specific conditions. Ample thermal headroom ensures zero conductivity and bond decay at rated temp.
Storage requirements?
Single-component but no cold chain required. Store at RT in cool, dry place. Shelf life: 12 months unopened.
Request TDS or Consult Application Engineer
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