SC618 500 °C Conductive Adhesive — Single-Component, Heat-Cure, High-Strength, Low-Resistance Bonding
SC618 500 °C conductive. Single-component, 30 MPa bond, zero outgassing at temperature. Bonds metals, ceramics, glass, quartz and SiC; low water absorption. Acid/alkali/solvent resistant. RT storage, no cold chain. Heat aging 168 h at 500 °C: 70% shear-strength retention.
High-power components, sensors and semiconductor process — bonding, sealing, filling and electrical conduction.
- Shear Strength
- 30 MPa
- Temperature Range
- −45 °C–500 °C
- Cure Condition
- 120 °C / 60 min
- Viscosity @ 25 °C
- 50000 mPa·s
SCITEO Rigorous Standards: Qualified under GJB 150 environmental reliability testing by Zhenhua, CETC, and CAC, delivering mission-critical reliability.
Engineered as high-reliability domestic qualified alternatives for semiconductor and defense manufacturing clusters across Shanghai Zhangjiang, Xi'an, Chengdu, and Wuxi.
Specifications Don't Match Your Operating Conditions?
Only the baseline series is shown here. SCITEO's undisclosed archive holds formulations engineered for extreme environments. Contact us — our application engineers will match you precisely.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating conditions.
Semiconductor Packaging
Ceramic Sensor Bonding
Semiconductor Process
Application Engineer FAQ
A structured brief from SCITEO covering physical properties, application standards, and related specifications.
Does conductivity decay at 500 °C?
No. SC618 is rated to 500 °C with short-term thermal headroom, and under inert or vacuum conditions the peak can reach 1000 °C. Conductivity and bond strength stay stable at the rated temperature.
Storage requirements?
Although a one-part system, SC618 requires no cold chain — store in a cool, dry place at room temperature. Unopened shelf life is 12 months; use promptly after opening per the handling instructions.
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