
Precision Molecular Engineering
SC616 1000°C Conductive Silver — 2K AB, Heat-Cure, Low Resistivity, Anti-Aging, High-Strength
1000°C conductive silver. 2K AB, heat-cure. Anti-aging, thermal-cycle resistant, 0.00004 Ω·cm. Bonds ceramic, glass, metal. Acid/alkali/solvent resistant.
Semiconductor fab, semiconductor equipment, sensors, aerospace/military — bonding, sealing, filling & conduction.
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.

Semiconductor process bonding

Semiconductor equipment bonding

Sensor thermal conduction
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
Advantages for semiconductor applications?
Long-term high-temp low resistivity — no softening or resistance decay at temp. Zero outgassing for ultra-clean fab/semiconductor equipment. Prevents ionic contamination.
Anti-aging advantages?
Wide −45–1000°C range for thermal shock cycling. −40–500°C 1000 cycles zero fracture. Acid/alkali/solvent immersion 24h+ with no corrosion.
Request TDS or Consult Application Engineer
Receive full Technical Data Sheets (TDS), Safety Data Sheets (SDS), and customized formulations. Please provide accurate information for verification.
Recommended Advanced Materials
Explore more SCITEO adhesive formulas for other critical application environments to close the loop on microelectronics safety.

SC618 500°C Conductive Adhesive — Single-Component, Heat-Cure, High-Strength, Low-Resistance Bonding
SC618 500°C conductive. Single-component, 30 MPa bond, zero outgassing at temp. Bonds metal/ceramic/glass. Acid/alkali/solvent resistant. RT storage, no cold chain.

SC6616 Die-Attach Conductive Silver — High-Strength, High-Tg, Low Resistivity, Thermal-Cure Epoxy
SC66 series single-component conductive silver epoxy. High die-shear strength, high-Tg for aging resistance, chip-grade. Multiple thermal conductivity grades, ultra-low resistivity, low-CTE. Dispensable & printable.

SC610 Extreme-Temp 500°C+ Adhesive — Low-CTE, Insulating, 1000°C Peak Hard Bond & Seal
Long-term 500–1000°C. Multi-viscosity. Anti-aging, thermal-cycling resistant, insulating, low-CTE. Zero outgassing, acid/alkali 24h+ resistant.