Precision Molecular Engineering
SC616 1000°C Conductive Silver — Two-Component, Heat-Cure, Low Resistivity, Anti-Aging, High-Strength
1000°C conductive silver. Two-component, heat-cure. Anti-aging, thermal-cycle resistant, 0.00004 Ω·cm. Bonds ceramic, glass, metal. Acid/alkali/solvent resistant.
Semiconductor fab, semiconductor equipment, sensors, aerospace/military — bonding, sealing, filling & conduction.
- Shear Strength
- 5 MPa
- Temperature Range
- −45 °C–1000 °C
- Cure Condition
- 150 °C / 30 min
- Viscosity @ 25 °C
- 25000 mPa·s
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
Specifications Don't Match Your Operating Conditions?
This page displays only the baseline product series. Within SCITEO's undisclosed database, we maintain extensive formulations engineered for extreme environments. Contact us directly — our application experts will deliver a precise match.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
Semiconductor Process
Semiconductor Equipment
Sensor Thermal Bonding
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
Advantages for semiconductor applications?
Long-term high-temp low resistivity — no softening or resistance decay at temp. Zero outgassing for ultra-clean fab/semiconductor equipment. Prevents ionic contamination.
Anti-aging advantages?
Wide −45–1000°C range for thermal shock cycling. −40–500°C 1000 cycles zero fracture. Acid/alkali/solvent immersion 24h+ with no corrosion.
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SC610 Extreme-Temp 500°C+ Adhesive — Low-CTE, Insulating, 1000°C Peak Rigid Bonding & Sealing
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