SC616 1000 °C Conductive Silver — Two-Component, Heat-Cure, Low Resistivity, Anti-Aging, High-Strength
1000 °C conductive silver. Two-component, heat-cure. Anti-aging, thermal-cycle resistant, 0.00004 Ω·cm. Bonds ceramics, glass, metals and SiC. Acid/alkali/solvent resistant. Heat aging 360 h at 500 °C: 90% shear retention.
Semiconductor process, semiconductor equipment, sensors and mil-spec defense components — bonding, sealing, filling and electrical conduction.
- Shear Strength
- 5 MPa
- Temperature Range
- −45 °C–1000 °C
- Cure Condition
- 150 °C / 30 min
- Viscosity @ 25 °C
- 25000 mPa·s
SCITEO Rigorous Standards: Qualified under GJB 150 environmental reliability testing by Zhenhua, CETC, and CAC, delivering mission-critical reliability.
Engineered as high-reliability domestic qualified alternatives for semiconductor and defense manufacturing clusters across Shanghai Zhangjiang, Xi'an, Chengdu, and Wuxi.
Specifications Don't Match Your Operating Conditions?
Only the baseline series is shown here. SCITEO's undisclosed archive holds formulations engineered for extreme environments. Contact us — our application engineers will match you precisely.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating conditions.
Semiconductor Process
Semiconductor Equipment
Sensor Thermal Bonding
Application Engineer FAQ
A structured brief from SCITEO covering physical properties, application standards, and related specifications.
Advantages for semiconductor applications?
Stable resistance under long-term high temperature, with no softening or resistivity drift; zero outgassing at temperature avoids ionic contamination of semiconductor processes and precision fab equipment.
Anti-aging advantages?
A wide −45 to 1000 °C range suits thermal shock cycling: 1000 cycles from −40 to 500 °C with no fracture, plus 24 h+ immersion in acids, alkalis, and solvents with no corrosion observed.
Request Technical Documentation or Consult an Application Engineer
Receive product documentation and customized formulations. Please provide accurate information for verification.
Recommended Advanced Materials
Explore more proven SCITEO solutions for other critical application environments to close the loop on microelectronics safety.
SC618 500 °C Conductive Adhesive — Single-Component, Heat-Cure, High-Strength, Low-Resistance Bonding
SC618 500 °C conductive. Single-component, 30 MPa bond, zero outgassing at temperature. Bonds metals, ceramics, glass, quartz and SiC; low water absorption. Acid/alkali/solvent resistant. RT storage, no cold chain. Heat aging 168 h at 500 °C: 70% shear-strength retention.
SC6616 Die-Attach Conductive Silver — High-Strength, High-Tg, Low Resistivity, Thermal-Cure Epoxy
SC66 series single-component conductive silver epoxy. High die-shear strength, high-Tg for aging resistance, chip-grade. Multiple thermal conductivity grades, ultra-low resistivity, low-CTE. Dispensable & printable. 2.6–5 GPa multi-grade tensile modulus. 500 thermal cycles (−40 to 125 °C): 84% shear retention; damp-heat 1000 h (85 °C / 85% RH): 70% shear retention.
SC610 Extreme-Temp 500 °C+ Adhesive — Low-CTE, Insulating, 1000 °C Peak Rigid Bonding & Sealing
Long-term service at 500–1000 °C. Multi-viscosity. Anti-aging, thermal-cycling resistant, insulating, low-CTE. Zero outgassing; non-corrosive, resistant to chemical solvents, acids and alkalis for 24 h+. Heat aging 168 h at 500 °C: 85% shear-strength retention.