SC610 Extreme-Temp 500 °C+ Adhesive — Low-CTE, Insulating, 1000 °C Peak Rigid Bonding & Sealing
Long-term service at 500–1000 °C. Multi-viscosity. Anti-aging, thermal-cycling resistant, insulating, low-CTE. Zero outgassing; non-corrosive, resistant to chemical solvents, acids and alkalis for 24 h+. Heat aging 168 h at 500 °C: 85% shear-strength retention.
Sensors, high-power assemblies, semiconductor wafer fabrication and military lasers — bonding, sealing and filling.
- Temperature Range
- −45 °C–1000 °C
- CTE below Tg
- 7.1 ppm/°C
- Shear Strength
- 16 MPa (etched Al)
- Volume Resistivity
- 1×10¹⁵ Ω·cm
SCITEO Rigorous Standards: Qualified under GJB 150 environmental reliability testing by Zhenhua, CETC, and CAC, delivering mission-critical reliability.
Engineered as high-reliability domestic qualified alternatives for semiconductor and defense manufacturing clusters across Shanghai Zhangjiang, Xi'an, Chengdu, and Wuxi.
Specifications Don't Match Your Operating Conditions?
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High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating conditions.
Sensor Bonding
High-Temperature Limit Test
Military Equipment Sensors
Application Engineer FAQ
A structured brief from SCITEO covering physical properties, application standards, and related specifications.
Long-term performance vs. other high-temp adhesives?
A continuous rating from 500 °C upward, insulating at temperature with zero outgassing in vacuum for dry-process compatibility; ultra-high-temperature grades reach a 1700 °C peak without softening.
Suitable for <500 °C? Acid/alkali resistance?
Yes. Stable over 720 h at 300–400 °C continuous duty, with 7.1 ppm/°C CTE already validated at wafer-level processes and 24 h immersion in 10% acid/alkali solutions without degradation.
Request Technical Documentation or Consult an Application Engineer
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