Precision Molecular Engineering
SC610 Extreme-Temp 500°C+ Adhesive — Low-CTE, Insulating, 1000°C Peak Hard Bond & Seal
Long-term 500–1000°C. Multi-viscosity. Anti-aging, thermal-cycling resistant, insulating, low-CTE. Zero outgassing, acid/alkali 24h+ resistant.
Sensors, high-power assemblies, wafer fab process, military laser bonding, sealing & filling.
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
Metal probe for sensors
High-Temperature Limit Test
Sensors for Military Equipment
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
Long-term performance vs. other high-temp adhesives?
500°C 72h+ with no discoloration or softening. Insulating at high temp, zero outgassing for vacuum processes. Ultimate variant withstands 1700°C.
Suitable for <500°C? Acid/alkali resistance?
Yes. 300–400°C continuous 30 days stable. Wafer-grade low CTE. 10% acid/alkali immersion 24h with no degradation.
Request TDS or Consult Application Engineer
Receive full Technical Data Sheets (TDS), Safety Data Sheets (SDS), and customized formulations. Please provide accurate information for verification.
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SC633 Long-Term 400°C Potting Compound — Thermal, Insulating, Acid/Alkali-Resistant, Single-Component
Long-term 400°C+ potting. 2.5 W/m·K thermal, insulating, acid/alkali/solvent resistant, dense fill, boil-proof with no delamination, zero high-temp outgassing.
SC6300 High-Temp 300°C Single-Component Epoxy — Insulating, Thermal-Cure, High-Strength Bonding
Single-component, ready-to-use. Heat-cure for high-strength bonding, 84D hardness, shock-resistant, insulating, withstands multiple reflow cycles. Dispensable & printable.
SC6219 60W Thermal+Conductive Epoxy — Single-Component, High Bond, Low-CTE, Low Resistivity
Ultra-high thermal+conductive epoxy. 60 W/m·K, 25 ppm low-CTE, 0.000006 Ω·cm ultra-low resistivity. High bond, heat-cure. Bonds metal/ceramic/glass/platings. Dispensable & printable.