SC6300 High-Temp 300 °C Single-Component Epoxy — Insulating, Thermal-Cure, High-Strength Bonding
QUALITY CONTROL100% Lab Tested
DISPENSING SPECNordson Syringe
OUTER PACKAGINGVacuum-Sealed
PACKAGING SPEC30cc/syringe
Permeating the silicon matrix from the unseen

SC6300 High-Temp 300 °C Single-Component Epoxy — Insulating, Thermal-Cure, High-Strength Bonding

Single-component, ready-to-use. Heat-cure for high-strength bonding, 84D hardness, shock-resistant, insulating, withstands multiple reflow cycles. Dispensable & printable. 3.9 GPa modulus; heat aging 500 h at 250 °C: 92% shear retention; 500 thermal cycles (−40 to 125 °C): 85% shear retention.

Typical Application

High-end sensors, semiconductor process, power components and metal/ceramic/glass substrates — bonding, sealing and filling.

Technical Specifications
Shear Strength
29 MPa (Si chip)
Temperature Range
−40 °C–300 °C
Cure Condition
120 °C / 30 min
Viscosity @ 25 °C
280000 mPa·s
* Multiple specifications are available for this series
SCITEO Rigorous Standards: Qualified under GJB 150 environmental reliability testing by Zhenhua, CETC, and CAC, delivering mission-critical reliability.

Engineered as high-reliability domestic qualified alternatives for semiconductor and defense manufacturing clusters across Shanghai Zhangjiang, Xi'an, Chengdu, and Wuxi.

SCITEO R&D ARCHIVE

Specifications Don't Match Your Operating Conditions?

Only the baseline series is shown here. SCITEO's undisclosed archive holds formulations engineered for extreme environments. Contact us — our application engineers will match you precisely.

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APPLICATION FIELDS

High Reliability Scenarios

Core positioning and partial application demonstration of this product under complex operating conditions.

SCITEO SC6300 high-temperature 300 °C epoxy adhesive applied to semiconductor process components

Semiconductor Process Components

SCITEO SC6300 high-temperature 300 °C epoxy adhesive applied in high-temperature sensor filling and sealing

High-Temp Sensor Sealing

SCITEO SC6300 high-temperature 300 °C single-component epoxy adhesive applied in LED optoelectronic chip packaging

Optoelectronic Display Chips

FAQ & ENGINEERING ANSWERS

Application Engineer FAQ

A structured brief from SCITEO covering physical properties, application standards, and related specifications.

Q

How does SC6300 maintain bond strength at 300 °C?

A

A hyperbranched modified epoxy matrix with anti-thermal-oxidative chemistry suppresses backbone degradation at 300 °C. No carbonization or powdering after 24 h at 300 °C; a low-outgassing system also limits interfacial voids.

Q

Does it require cold-chain shipping? Shelf life?

A

Yes. Ship on dry ice and transfer straight to −20 °C storage; unopened, never-thawed product holds a 12-month shelf life. Thaw at room temperature for at least 1.5 h and keep the syringe sealed until fully equilibrated; do not re-freeze after thawing.

Engineering Support

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