Precision Molecular Engineering
SC6300 High-Temp 300°C Single-Component Epoxy — Insulating, Thermal-Cure, High-Strength Bonding
Single-component, ready-to-use. Heat-cure for high-strength bonding, 84D hardness, shock-resistant, insulating, withstands multiple reflow cycles. Dispensable & printable.
Sensors, semiconductor process, power components, ceramic/metal/glass bonding, sealing & filling.
- Shear Strength
- 29 MPa (Si chip)
- Temperature Range
- −40 °C–300 °C
- Cure Condition
- 120 °C / 30 min
- Viscosity @ 25 °C
- 280000 mPa·s
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
Specifications Don't Match Your Operating Conditions?
This page displays only the baseline product series. Within SCITEO's undisclosed database, we maintain extensive formulations engineered for extreme environments. Contact us directly — our application experts will deliver a precise match.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
Semiconductor Probe
High-Temp Sensor Sealing
Optoelectronic Display Chips
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
How does SC6300 maintain bond strength at 300°C?
Hyperbranched modified epoxy matrix with anti-thermal-oxidative formulation prevents polymer chain degradation. High-density crosslink network with low-outgassing filler suppresses voids, providing stable physical and van der Waals adhesion.
Does it require cold-chain shipping? Shelf life?
Yes. Store at −20°C; unopened shelf life 6 months. Thaw at room temperature ≥1.5 hrs before use.
Request TDS or Consult Application Engineer
Receive product documentation and customized formulations. Please provide accurate information for verification.
Recommended Advanced Materials
Explore more SCITEO adhesive formulas for other critical application environments to close the loop on microelectronics safety.
SC6630 300°C Transparent Epoxy — Single-Component, High-Strength, Insulating, Rigid Bonding & Sealing
Transparent single-component, ready-to-use. Heat-cure for high bond strength, insulating, 300°C, multi-reflow resistant. Dispensable & printable.
SC610 Extreme-Temp 500°C+ Adhesive — Low-CTE, Insulating, 1000°C Peak Rigid Bonding & Sealing
Long-term 500–1000°C. Multi-viscosity. Anti-aging, thermal-cycling resistant, insulating, low-CTE. Zero outgassing, acid/alkali 24h+ resistant.
SC633 Long-Term 400°C Potting Compound — Thermal, Insulating, Acid/Alkali-Resistant, Single-Component
Long-term 400°C+ potting. 2.5 W/m·K thermal, insulating, acid/alkali/solvent resistant, dense fill, boil-proof with no delamination, zero high-temp outgassing.