SC633 Long-Term 400 °C Potting Compound — Thermal, Insulating, Acid/Alkali-Resistant, Single-Component
Long-term 400 °C+ potting. 2.5 W/m·K thermal, insulating, acid/alkali/solvent resistant, dense, void-free fill, boil-proof with no delamination, zero high-temp outgassing. Heat aging 360 h at 400 °C: 96% shear-strength retention.
Semiconductor process, wafer fabrication, high-end sensors and power modules — long-term high-temperature insulation and thermal conduction.
- Thermal Conductivity
- 2.5 W/m·K
- Temperature Range
- −40 °C–600 °C
- Cure Condition
- 150 °C / 30 min
- Viscosity @ 25 °C
- 3000 mPa·s
SCITEO Rigorous Standards: Qualified under GJB 150 environmental reliability testing by Zhenhua, CETC, and CAC, delivering mission-critical reliability.
Engineered as high-reliability domestic qualified alternatives for semiconductor and defense manufacturing clusters across Shanghai Zhangjiang, Xi'an, Chengdu, and Wuxi.
Specifications Don't Match Your Operating Conditions?
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High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating conditions.
Military Connector Potting
Ceramic Sensor Filling
Military Sensor Potting
Application Engineer FAQ
A structured brief from SCITEO covering physical properties, application standards, and related specifications.
What makes SC633 different from standard potting compounds?
A peak above 600 °C with no discoloration, cracking or powdering under long-term continuous duty; insulating and thermally stable, with 24 h+ acid, alkali and solvent resistance.
Benefits of zero outgassing?
Ionic species released at temperature deposit on glass and plated metal and contaminate PVD vacuum chambers; enclosed-cavity outgassing can also induce micro-cracks. SC633 is dry-process compatible.
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