
Precision Molecular Engineering
SC633 Long-Term 400°C Potting Compound — Thermal, Insulating, Acid/Alkali-Resistant, Single-Component
Long-term 400°C+ potting. 2.5 W/m·K thermal, insulating, acid/alkali/solvent resistant, dense fill, boil-proof with no delamination, zero high-temp outgassing.
Semiconductor fab, wafer manufacturing, sensors, power modules — long-term high-temp insulating & thermal applications.
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.

Military connector potting

Ceramic sensor filling

Military sensor encapsulation
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
What makes SC633 different from standard potting compounds?
Peak 600°C+, 400°C 72h+ continuous, 300°C 30-day continuous — no discoloration or cracking. High-temp insulating & thermal stable. Acid/alkali/solvent 24h+ immersion resistant.
Benefits of zero outgassing?
Ionic outgassing at high temp contaminates sensitive components (glass, plated metal, PVD vacuum). Enclosed-cavity outgassing can cause micro-cracks. SC633 is dry-process compatible.
Request TDS or Consult Application Engineer
Receive full Technical Data Sheets (TDS), Safety Data Sheets (SDS), and customized formulations. Please provide accurate information for verification.
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SC6080 Thermal Potting Epoxy — High-Hardness, RT-Cure, Insulating, Low-Viscosity, 2K AB
Thermal series. 2K AB, RT-cure. Bonds metal, ceramic, glass. High hardness, impact-resistant, insulating. 2.0 W/m·K, low viscosity.

SC6002 280°C Potting Epoxy — 2.5W Thermal, Low-CTE, Insulating, 30 MPa, Two-Component AB
Low-viscosity self-leveling, 280°C, 30 MPa bond, 2.5 W/m·K, HB flame-retardant insulating. Low CTE compatible with varied substrates.

SC3960 −70°C Cryogenic Epoxy — Thermal, High/Low-Temp Cycling, 96D Ultra-Hard, Potting & Bonding
SC3960 cryogenic epoxy. −70°C no cracking, Mil-Std pass. 180°C high-temp, 1.5 W/m·K thermal. 96D hardness: 200 MPa compressive, 120 MPa flexural. Bonds military & automotive-grade parts.