峻茂新材料 (SCITEO) - 半导体封装与高阶制造高性能胶供应商
峻茂新材料 (SCITEO) - 半导体封装与高阶制造高性能胶供应商
SC3960 −70°C Cryogenic Epoxy — Thermal, High/Low-Temp Cycling, 96D Ultra-Hard, Potting & Bonding
SCITEO LAB TRUST100% Lab Tested
DISPENSING HARDWARENordson Syringe
STABILITY PROTECTIONSyringe Vacuum Pack
PACKAGINGPackaging: 10kg/kit

Precision Molecular Engineering

SC3960 −70°C Cryogenic Epoxy — Thermal, High/Low-Temp Cycling, 96D Ultra-Hard, Potting & Bonding

SC3960 cryogenic epoxy. −70°C no cracking, Mil-Std pass. 180°C high-temp, 1.5 W/m·K thermal. 96D hardness: 200 MPa compressive, 120 MPa flexural. Bonds military & automotive-grade parts.

Typical Application

Sensors, Mil-Std components, automotive-grade parts — bonding, sealing, filling & thermal management.

Technical Specifications
Hardness96 D
Temp Range−70°C – 180°C
Cure ConditionRT or heat cure
Viscosity @25°C5,000–65,000 mPa·s
* Multiple specifications are available for this series.
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.

This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.

APPLICATION FIELDS

High Reliability Scenarios

Core positioning and partial application demonstration of this product under complex operating cycles.

SC3960 cryogenic epoxy for military sensor bonding, sealing & thermal

Military sensor bonding

SC3960 cryogenic epoxy for automotive-grade component bonding & sealing

Vehicle component bonding

SC3960 cryogenic epoxy for military filter potting, bonding & sealing

Military filter potting

FAQ & RESOLUTIONS

Application Engineer FAQ

SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.

Q

What mechanical strength does SC3960 provide?

A

Mil-Std grade: 96D hardness, 200 MPa compressive, 120 MPa flexural, 26 MPa RT shear. Engineered to pass destructive testing per military specs.

Q

How does 96D hardness pass Mil-Std cryogenic cycling?

A

Three mechanisms: 30 ppm low CTE (advanced packaging grade), 0.1% ultra-low shrinkage vs. cryogenic internal stress, 0.03% low moisture absorption. Multi-stage cure profile maximizes temp performance.

SCITEO Application Engineering Support

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