
SC3960 −70 °C Cryogenic Epoxy — Thermal, High/Low-Temp Cycling, 96D Ultra-Hard, Potting & Bonding
SC3960 cryogenic epoxy. −70 °C no cracking, Mil-Std pass. 180 °C high-temp, 1.5 W/m·K thermal. 96D hardness: 200 MPa compressive, 120 MPa flexural. Bonds military & automotive-grade parts. 1000 thermal cycles (−40 to 125 °C): 96% shear retention.
Sensors, military-standard assemblies and automotive-grade parts — bonding, sealing, filling and thermal conduction.
- Shore Hardness
- 96 Shore D
- Temperature Range
- −70 °C–180 °C
- Cure Condition
- RT or heat cure
- Viscosity @ 25 °C
- 5000–65000 mPa·s
SCITEO Rigorous Standards: Qualified under GJB 150 environmental reliability testing by Zhenhua, CETC, and CAC, delivering mission-critical reliability.
Engineered as high-reliability domestic qualified alternatives for semiconductor and defense manufacturing clusters across Shanghai Zhangjiang, Xi'an, Chengdu, and Wuxi.
Specifications Don't Match Your Operating Conditions?
Only the baseline series is shown here. SCITEO's undisclosed archive holds formulations engineered for extreme environments. Contact us — our application engineers will match you precisely.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating conditions.

Military Sensor Bonding

Automotive Parts Bonding

Military-Standard Component Potting
Application Engineer FAQ
A structured brief from SCITEO covering physical properties, application standards, and related specifications.
What mechanical strength does SC3960 provide?
Mil-spec grade: 96D hardness with impact resistance, 200 MPa compressive, 120 MPa flexural, 26 MPa room-temperature shear, and a 3.1 GPa modulus — engineered to pass destructive testing.
How does 96D hardness pass Mil-Std cryogenic cycling?
Multiple mechanisms: 30 ppm/°C low CTE at advanced-packaging grade, 0.1% low cure shrinkage and 0.03% low moisture absorption countering cryogenic stress, plus a multi-stage cure profile that unlocks its thermal limits.
Request Technical Documentation or Consult an Application Engineer
Receive product documentation and customized formulations. Please provide accurate information for verification.
Recommended Advanced Materials
Explore more proven SCITEO solutions for other critical application environments to close the loop on microelectronics safety.

SC673 Cryogenic −255 °C Epoxy — High-Strength, Anti-Aging, Insulating, Thermal-Cycling Resistant
Cryogenic epoxy. −255 °C no interfacial cracking, 180 °C high-temp. Thermally conductive, vibration/flex resistant, passes multiple aging tests. Medium viscosity, wide substrate compatibility, chemical/thermal-cycling resistant. LN2 soak 1000 h at −196 °C: 95% shear retention; solvent/damp-heat soak 720 h: 22 MPa retained.

SC633 Long-Term 400 °C Potting Compound — Thermal, Insulating, Acid/Alkali-Resistant, Single-Component
Long-term 400 °C+ potting. 2.5 W/m·K thermal, insulating, acid/alkali/solvent resistant, dense, void-free fill, boil-proof with no delamination, zero high-temp outgassing. Heat aging 360 h at 400 °C: 96% shear-strength retention.

SC6002 280 °C Potting Epoxy — 2.5 W Thermal, Low-CTE, Insulating, 30 MPa, Two-Component
Low-viscosity self-leveling, 280 °C, 30 MPa bond, 2.5 W/m·K, HB flame-retardant insulating. Low CTE compatible with varied substrates. 1000 thermal cycles (−40 to 125 °C): 88% shear retention; damp-heat 1000 h (85 °C / 85% RH): 80% shear retention.