Precision Molecular Engineering
SC673 Cryogenic −255°C Epoxy — High-Strength, Anti-Aging, Insulating, Thermal-Cycle Resistant
Cryogenic epoxy. −255°C no interfacial cracking, 180°C high-temp. Thermal, vibration/flex resistant, multi-aging pass. Medium viscosity, wide substrate compatibility, chemical/thermal-cycle resistant.
Quantum computers, quantum chips, superconducting magnets, cryogenic sensors — bonding, sealing & filling.
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
Cryogenic sensor seal
Liquid nitrogen sensor bonding
Quantum computer component bonding
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
High-temp performance?
SC673 long-term heat aging: 180°C 1000 hrs, shear 3.5 MPa (initial 28 MPa on etched Al).
How does SC673 maintain bond at cryogenic temps?
Extremely low modulus — doesn't spike at cryogenic temps. Even at liquid-nitrogen temp, modulus ≈ ambient-temp modulus of standard epoxies. 5N peel strength grants high fracture toughness, suppressing cryogenic micro-crack initiation.
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SC3960 cryogenic epoxy. −70°C no cracking, Mil-Std pass. 180°C high-temp, 1.5 W/m·K thermal. 96D hardness: 200 MPa compressive, 120 MPa flexural. Bonds military & automotive-grade parts.
SC6106 Low-Temp Cure Epoxy — 60–80°C Thermal Cure, Low Moisture Absorption, Single-Component Insulating
Single-component, fast low-temp cure. Reflow-compatible, high bond strength, bonds most substrates. Minimum cure temp 55°C.
SC6360 Heat-Cure Silicone — Fast Full Cure, Single-Component, Bonding, Seal, Insulating, Thermal
Heat-cure silicone. 30-min full cure avoids RT cure delays. For complex enclosed structures. Insulating elastomer, high elongation, low-stress anti-fracture.