SC673 Cryogenic −255 °C Epoxy — High-Strength, Anti-Aging, Insulating, Thermal-Cycling Resistant
QUALITY CONTROL100% Lab Tested
DISPENSING SPECNordson Syringe
OUTER PACKAGINGVacuum-Sealed
PACKAGING SPEC50g/kit
Permeating the silicon matrix from the unseen

SC673 Cryogenic −255 °C Epoxy — High-Strength, Anti-Aging, Insulating, Thermal-Cycling Resistant

Cryogenic epoxy. −255 °C no interfacial cracking, 180 °C high-temp. Thermally conductive, vibration/flex resistant, passes multiple aging tests. Medium viscosity, wide substrate compatibility, chemical/thermal-cycling resistant. LN2 soak 1000 h at −196 °C: 95% shear retention; solvent/damp-heat soak 720 h: 22 MPa retained.

Typical Application

Quantum computers, quantum chips, superconducting magnets and low-temperature sensors — bonding, sealing and filling.

Technical Specifications
Shear Strength
17 MPa (−255 °C)
Temperature Range
−255 °C–180 °C
Aging Resistance
100% RH / 70 °C / 720 h
Viscosity @ 25 °C
40000 mPa·s
* Multiple specifications are available for this series
SCITEO Rigorous Standards: Qualified under GJB 150 environmental reliability testing by Zhenhua, CETC, and CAC, delivering mission-critical reliability.

Engineered as high-reliability domestic qualified alternatives for semiconductor and defense manufacturing clusters across Shanghai Zhangjiang, Xi'an, Chengdu, and Wuxi.

SCITEO R&D ARCHIVE

Specifications Don't Match Your Operating Conditions?

Only the baseline series is shown here. SCITEO's undisclosed archive holds formulations engineered for extreme environments. Contact us — our application engineers will match you precisely.

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APPLICATION FIELDS

High Reliability Scenarios

Core positioning and partial application demonstration of this product under complex operating conditions.

SCITEO low-temperature-resistant epoxy adhesive for cryogenic sensor filling and sealing

Cryogenic Sensor Sealing

SCITEO low-temperature-resistant epoxy adhesive for cryogenic sensor bonding

Cryogenic Sensor Bonding

SCITEO low-temperature-resistant epoxy adhesive for quantum computer component bonding, sealing and filling

Quantum Computer Bonding

FAQ & ENGINEERING ANSWERS

Application Engineer FAQ

A structured brief from SCITEO covering physical properties, application standards, and related specifications.

Q

High-temp performance?

A

SC673 is verified by long-term heat aging: 32 MPa initial shear strength at room temperature, retaining 3.5 MPa after 1000 h at 180 °C on etched aluminum — well above the reworkable threshold for a flexible system.

Q

How does SC673 maintain bond at cryogenic temps?

A

Its very low modulus avoids the cryogenic stiffening typical of rigid epoxies: near liquid-nitrogen temperatures it stays close to the ambient modulus of a standard epoxy, and 5 N/mm peel toughness suppresses cold micro-cracking.

Engineering Support

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