Precision Molecular Engineering
SC6360 Heat-Cure Silicone — Fast Full Cure, Single-Component, Bonding, Sealing, Insulating, Thermal
Heat-cure silicone. 30-min full cure avoids RT cure delays. For complex enclosed structures. Insulating elastomer, high elongation, low-stress anti-fracture.
Semiconductor components, sensors, advanced packaging — bonding, sealing, fixing, filling, thermal & insulation.
- Shear Strength
- 3.9 MPa
- Temperature Range
- −55 °C–220 °C
- Cure Condition
- 120 °C / 30 min
- Viscosity @ 25 °C
- 600000 mPa·s
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
Specifications Don't Match Your Operating Conditions?
This page displays only the baseline product series. Within SCITEO's undisclosed database, we maintain extensive formulations engineered for extreme environments. Contact us directly — our application experts will deliver a precise match.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
Semiconductor Bonding
Quantum Computer Bonding
Precision Bonding
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
Why heat-cure? Cure speed?
Single-component silicones depend on air contact — enclosed structures risk cure anomalies. Standard silicones: 24–48h cure, 7 days to full properties. SC6360: 30-min heat, fully cured.
Thermomechanical properties?
Retains silicone advantages: 2.5 W/m·K, elongation at break 46%, tensile strength 8 MPa, elastomeric low-stress failure mode.
Request TDS or Consult Application Engineer
Receive product documentation and customized formulations. Please provide accurate information for verification.
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