SC6360 Heat-Cure Silicone — Fast Full Cure, Single-Component, Bonding, Sealing, Insulating, Thermal
Heat-cure silicone. 30-min full cure avoids RT cure delays. For complex enclosed structures. Insulating elastomer, high elongation, low-stress anti-fracture.
Semiconductor components, sensors and power modules — bonding, sealing, fixation, filling, thermal conduction and insulation.
- Shear Strength
- 6 MPa
- Temperature Range
- −55 °C–220 °C
- Cure Condition
- 120 °C / 30 min
- Viscosity @ 25 °C
- 600000 mPa·s
SCITEO Rigorous Standards: Qualified under GJB 150 environmental reliability testing by Zhenhua, CETC, and CAC, delivering mission-critical reliability.
Engineered as high-reliability domestic qualified alternatives for semiconductor and defense manufacturing clusters across Shanghai Zhangjiang, Xi'an, Chengdu, and Wuxi.
Specifications Don't Match Your Operating Conditions?
Only the baseline series is shown here. SCITEO's undisclosed archive holds formulations engineered for extreme environments. Contact us — our application engineers will match you precisely.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating conditions.
Semiconductor Bonding
Quantum Computer Bonding
Precision Bonding
Application Engineer FAQ
A structured brief from SCITEO covering physical properties, application standards, and related specifications.
Why heat-cure? Cure speed?
Most one-component silicones cure by moisture, which struggles to penetrate enclosed structures. SC6360 uses an addition-cure system triggered by heat: 120 °C for 30 min fully cures it regardless of enclosure.
Thermomechanical properties?
It keeps the core silicone advantages: 2.5 W/m·K, 46% elongation at break and 8 MPa tensile strength — an elastomeric, low-stress failure mode that also withstands repeated high-temperature reflows.
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