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SC609 Flexible High-Transparency PU — Two-Component, RT-Cure, High Elongation, Bonding, Sealing, Anti-Aging
SCITEO LAB TRUST100% Lab Tested
DISPENSING HARDWARENordson Syringe
OUTER PACKAGINGVacuum Packaging
PACKAGING50ml/syringe
Permeating the silicon matrix from the unseen

Precision Molecular Engineering

SC609 Flexible High-Transparency PU — Two-Component, RT-Cure, High Elongation, Bonding, Sealing, Anti-Aging

Flexible, high-peel-strength PU. Crystal-clear, high tensile elongation. RT-cure, chemical-resistant, humidity/heat aging. 34 kV/mm dielectric strength. Bonds plastics, glass, metal.

Typical Application

Optical assemblies, sensors, automotive-grade parts, semiconductor fab, flexible electronics — bonding, sealing & filling.

Technical Specifications
Shear Strength
10 MPa
Temperature Range
−45 °C–150 °C
Cure Condition
25 °C / 24 h
Viscosity @ 25 °C
5000 mPa·s
* Multiple specifications are available for this series.
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.

This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.

SCITEO R&D ARCHIVE

Specifications Don't Match Your Operating Conditions?

This page displays only the baseline product series. Within SCITEO's undisclosed database, we maintain extensive formulations engineered for extreme environments. Contact us directly — our application experts will deliver a precise match.

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APPLICATION FIELDS

High Reliability Scenarios

Core positioning and partial application demonstration of this product under complex operating cycles.

SCITEO flexible high-transparency PU adhesive for FPC component bonding, sealing and protection

FPC Component Bonding

SCITEO flexible high-transparency PU adhesive for flexible wearable electronics bonding, sealing and filling

Flexible Wearable Bonding

SCITEO flexible high-transparency PU adhesive for automotive-grade chip bonding, sealing and filling

Automotive Chip Underfill

FAQ & ENGINEERING ANSWERS

Application Engineer FAQ

SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.

Q

Anti-aging performance?

A

IPA solvent immersion 500h: 100% shear retention. 150°C 1000h heat aging: 1 MPa. 80°C/95%RH 500h: 1 MPa. Shorter tests yield far higher strength.

Q

ASTM mechanical properties?

A

Flexible system: tensile 20 MPa, elongation 180%, T-peel 8 N/mm. As a transparent adhesive: 34 kV/mm dielectric strength — excellent protection for underwater/high-humidity electronics.

SCITEO Application Engineering Support

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