Precision Molecular Engineering
SC6114 4.5W Thermal Epoxy — High-Strength, High-Temp, Single-Component Heat-Cure Rigid Adhesive
Heat-cure thermal adhesive. High-temp 280°C, shock-resistant, insulating, reflow-compatible. 4.5 W/m·K, single-component, no pot-life limits.
Power devices, sensors, compute chips, heat-sink assembly bonding, thermal sealing & insulation.
- Viscosity @ 25 °C
- 280000 mPa·s
- Temperature Range
- −45 °C–280 °C
- Shear Strength
- 28 MPa (etched Al)
- Cure Condition
- 120 °C / 30 min
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
Specifications Don't Match Your Operating Conditions?
This page displays only the baseline product series. Within SCITEO's undisclosed database, we maintain extensive formulations engineered for extreme environments. Contact us directly — our application experts will deliver a precise match.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
High-Power Chip Bonding
Water-Cooled Heat Sink
Power Module Bonding
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
How does SC6114 differ from standard thermal adhesives?
Stronger bond, 84D post-cure hardness, 280°C thermal headroom ensures thermal conductivity stability under complex cycling.
Advantages of single-component?
No mixing, no pot-life limits, ready-to-use. Compatible with dispensing, printing, and coating processes.
Request TDS or Consult Application Engineer
Receive product documentation and customized formulations. Please provide accurate information for verification.
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SC6219 60W Thermal+Conductive Epoxy — Single-Component, High Bond, Low-CTE, Low Resistivity
Ultra-high thermal+conductive epoxy. 60 W/m·K, 25 ppm low-CTE, 0.000006 Ω·cm ultra-low resistivity. High bond, heat-cure. Bonds metal/ceramic/glass/platings. Dispensable & printable.