SC6114 4.5 W Thermal Epoxy — High-Strength, High-Temp, Single-Component Heat-Cure Rigid Adhesive
Heat-cure thermal adhesive. High-temp 280 °C, shock-resistant, insulating, reflow-compatible. 4.5 W/m·K, single-component, no pot-life limits. CTE 27 ppm; 500 thermal cycles (−40 to 125 °C): 96% shear retention; heat aging 1000 h at 165 °C: 85% shear retention.
Power devices, sensors, compute chips, thermal modules and PCBAs — bonding, thermal conduction, sealing and insulation.
- Viscosity @ 25 °C
- 280000 mPa·s
- Temperature Range
- −45 °C–280 °C
- Shear Strength
- 28 MPa (etched Al)
- Cure Condition
- 120 °C / 30 min
SCITEO Rigorous Standards: Qualified under GJB 150 environmental reliability testing by Zhenhua, CETC, and CAC, delivering mission-critical reliability.
Engineered as high-reliability domestic qualified alternatives for semiconductor and defense manufacturing clusters across Shanghai Zhangjiang, Xi'an, Chengdu, and Wuxi.
Specifications Don't Match Your Operating Conditions?
Only the baseline series is shown here. SCITEO's undisclosed archive holds formulations engineered for extreme environments. Contact us — our application engineers will match you precisely.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating conditions.
High-Power Chip Bonding
Thermal Component Bonding
Power Module Bonding
Application Engineer FAQ
A structured brief from SCITEO covering physical properties, application standards, and related specifications.
How does SC6114 differ from standard thermal adhesives?
SC6114 unifies 4.5 W/m·K conduction with 28 MPa shear strength: high post-cure hardness, a 280 °C ceiling, and stable bond strength under thermal cycling.
Advantages of single-component?
Efficient and ready-to-use with no mixing or pot-life limits, and compatible with dispensing, printing, and coating. Heat cure yields higher crosslink density than ambient cure.
Request Technical Documentation or Consult an Application Engineer
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