Precision Molecular Engineering
SC6114 4.5W Thermal Epoxy — High-Strength, High-Temp, Single-Component Heat-Cure Hard Adhesive
Heat-cure thermal adhesive. High-temp 280°C, shock-resistant, insulating, reflow-compatible. 4.5 W/m·K, single-component, no pot-life limits.
Power devices, sensors, compute chips, heat-sink assembly bonding, thermal sealing & insulation.
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
High-power chips
Water-cooled heat sink
Power module thermal management
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
How does SC6114 differ from standard thermal adhesives?
Stronger bond, 84D post-cure hardness, 280°C thermal headroom ensures conductivity stability under complex cycling.
Advantages of single-component?
No mixing, no pot-life limits, ready-to-use. Compatible with dispensing, printing, and coating processes.
Request TDS or Consult Application Engineer
Receive full Technical Data Sheets (TDS), Safety Data Sheets (SDS), and customized formulations. Please provide accurate information for verification.
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