Precision Molecular Engineering
SC6218 20W Thermal Epoxy — High-Tg 195°C, Long-Term Anti-Aging, High-Strength, Low-CTE 28 ppm
SC6218 20W thermal epoxy. Tg 195°C, 190°C/1800h aging zero decay. CTE 28 ppm, 22 MPa bond. Single-component, heat-cure. Bonds metal/ceramic/glass/plating.
High-power components, compute chips, power modules, novel semiconductors — bonding, sealing, filling & thermal management.
- Shear Strength
- 22 MPa
- Temperature Range
- −45 °C–280 °C
- Cure Condition
- 150 °C / 30 min
- Viscosity @ 25 °C
- 12000 mPa·s
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
Specifications Don't Match Your Operating Conditions?
This page displays only the baseline product series. Within SCITEO's undisclosed database, we maintain extensive formulations engineered for extreme environments. Contact us directly — our application experts will deliver a precise match.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
High-Power Chip Bonding
Military Laser Chip Bonding
MEMS Chip Sensor Bonding
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
Is 20W thermal conductivity overrated? What test method?
SC6218 uses laser flash method per ASTM E1461, measured on Au-plated chip bonding substrate. Many inflated claims stem from inconsistent test standards — ours are application-realistic.
How does SC6218 differ from standard thermal adhesives? Anti-aging proof?
Beyond 20W thermal: Tg 195°C for high-temp stability. 190°C/1800h continuous heat aging with zero bond decay — validated for long-life power electronics.
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