Precision Molecular Engineering
SC6218 20W Thermal Epoxy — High-Tg 195°C, Long-Term Anti-Aging, High-Strength, Low-CTE 28 ppm
SC6218 20W thermal epoxy. Tg 195°C, 190°C/1800h aging zero decay. CTE 28 ppm, 22 MPa bond. Single-component, heat-cure. Bonds metal/ceramic/glass/plating.
High-power components, compute chips, power modules, novel semiconductors — bonding, sealing, filling & thermal management.
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
High-power chip thermally conductive bonding
Military Chip Thermal Management
Thermal conductive bonding for MEMS
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
Is 20W thermal conductivity overrated? What test method?
SC6218 uses laser flash method per ASTM E1461, measured on Au-plated chip bonding substrate. Many inflated claims stem from inconsistent test standards — ours are application-realistic.
How does SC6218 differ from standard thermal adhesives? Anti-aging proof?
Beyond 20W thermal: Tg 195°C for high-temp stability. 190°C/1800h continuous heat aging with zero bond decay — validated for long-life power electronics.
Request TDS or Consult Application Engineer
Receive full Technical Data Sheets (TDS), Safety Data Sheets (SDS), and customized formulations. Please provide accurate information for verification.
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SC6112 37W Thermal Epoxy — High-Strength, Single-Component, Insulating, Low-CTE 13 ppm, Anti-Aging
37W thermal epoxy. Single-component, no pot-life limits. Low viscosity, thixotropic. Multi-reflow compatible, 13 ppm ultra-low CTE, high bond strength margin.
SC6920 8W High-Thermal Gel — Non-Curing, Insulating, Low Thermal Resistance, Single-Component
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SC6960 9W High-Thermal Gel — Anti-Aging, Gap Fill, Seal, Cryogenic, Insulating, Single-Component PCM
9W thermal PCM. Wide-temp, 1000h+ multi-aging test pass, 0.04°C/W. Single-component, ready-to-use liquid, flowable.