SC6218 20 W Thermal Epoxy — High-Tg 195 °C, Long-Term Anti-Aging, High-Strength, Low-CTE 28 ppm
SC6218 20 W thermal epoxy. Tg 195 °C, 1800 h at 190 °C: 95% shear retention. CTE 28 ppm, 22 MPa bond. Single-component, heat-cure. Bonds metal/ceramic/glass/plating. Dispensable & printable. 500 thermal cycles (−40 to 125 °C): 95% shear retention; damp-heat 1000 h (85 °C / 85% RH): 82% shear retention.
High-power components, compute chips, power modules and advanced semiconductors — bonding, sealing, filling and thermal conduction.
- Shear Strength
- 22 MPa
- Temperature Range
- −45 °C–280 °C
- Cure Condition
- 150 °C / 30 min
- Viscosity @ 25 °C
- 12000 mPa·s
SCITEO Rigorous Standards: Qualified under GJB 150 environmental reliability testing by Zhenhua, CETC, and CAC, delivering mission-critical reliability.
Engineered as high-reliability domestic qualified alternatives for semiconductor and defense manufacturing clusters across Shanghai Zhangjiang, Xi'an, Chengdu, and Wuxi.
Specifications Don't Match Your Operating Conditions?
Only the baseline series is shown here. SCITEO's undisclosed archive holds formulations engineered for extreme environments. Contact us — our application engineers will match you precisely.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating conditions.
High-Power Chip Bonding
Military Laser Bonding
MEMS Chip Sensor Bonding
Application Engineer FAQ
A structured brief from SCITEO covering physical properties, application standards, and related specifications.
Is 20 W thermal conductivity overrated? What test method?
Inconsistent standards do muddy thermal-conductivity figures. SC6218 measures thermal diffusivity by laser flash (ASTM E1461), converts via density and specific heat, then cross-checks with ASTM D5470 on Au-plated chips.
How does SC6218 differ from standard thermal adhesives? Anti-aging proof?
SC6218 is a heat-cure rigid thermal adhesive: 20 W/m·K, a 195 °C Tg and 28 ppm low CTE give high-temp resistance and aging stability, and its flowable profile avoids the no-flow limits of conventional thermal adhesives.
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