Precision Molecular Engineering
SC6920 8W High-Thermal Gel — Non-Curing, Insulating, Low Thermal Resistance, Single-Component
Thermal gel series, 4–11 W/m·K. Single-component & 2K AB. Non-curing — no powdering, no bleed over lifetime. 0.04°C/W, insulating, V0 flame-retardant.
Automotive thermal assemblies, comm modules, data centers, power assemblies, compute-chip gap filling.
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
Car radiator component potting
Communication module potting
Data center power component potting
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
What do different colors mean?
No performance difference. Available in grey, red, blue, white — color may assist visual identification in production.
Why non-curing?
Soft, compliant — adapts to any compression, protects sensitive components. Lifetime 100% wetting, no dry-out. Unlimited open time, reworkable. No bond strength.
Request TDS or Consult Application Engineer
Receive full Technical Data Sheets (TDS), Safety Data Sheets (SDS), and customized formulations. Please provide accurate information for verification.
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SC6112 37W Thermal Epoxy — High-Strength, Single-Component, Insulating, Low-CTE 13 ppm, Anti-Aging
37W thermal epoxy. Single-component, no pot-life limits. Low viscosity, thixotropic. Multi-reflow compatible, 13 ppm ultra-low CTE, high bond strength margin.
SC6218 20W Thermal Epoxy — High-Tg 195°C, Long-Term Anti-Aging, High-Strength, Low-CTE 28 ppm
SC6218 20W thermal epoxy. Tg 195°C, 190°C/1800h aging zero decay. CTE 28 ppm, 22 MPa bond. Single-component, heat-cure. Bonds metal/ceramic/glass/plating.
SC6114 4.5W Thermal Epoxy — High-Strength, High-Temp, Single-Component Heat-Cure Hard Adhesive
Heat-cure thermal adhesive. High-temp 280°C, shock-resistant, insulating, reflow-compatible. 4.5 W/m·K, single-component, no pot-life limits.