
Precision Molecular Engineering
SC6920 8W High-Thermal Gel — Non-Curing, Insulating, Low Thermal Resistance, Single-Component
Thermal gel series, 4–11 W/m·K. Single-component & two-component. Non-curing — no powdering, no bleed over lifetime. 0.04°C/W, insulating, V0 flame-retardant.
Automotive thermal assemblies, comm modules, data centers, power assemblies, compute-chip gap filling.
- Thermal Resistance
- 0.04 °C/W
- Temperature Range
- −40 °C–240 °C
- Cure Condition
- Non-curing
- Viscosity @ 25 °C
- Paste
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
Specifications Don't Match Your Operating Conditions?
This page displays only the baseline product series. Within SCITEO's undisclosed database, we maintain extensive formulations engineered for extreme environments. Contact us directly — our application experts will deliver a precise match.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.

Automotive Radiator Potting

Telecom Module Potting

Data Center Power Potting
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
What do different colors mean?
No performance difference. Available in grey, red, blue, white — color may assist visual identification in production.
Why non-curing?
Soft and compliant — adapts to compression, protects sensitive components. Maintains 100% wetting over service life, no dry-out. Unlimited open time, reworkable. Provides no mechanical strength.
Request TDS or Consult Application Engineer
Receive product documentation and customized formulations. Please provide accurate information for verification.
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5W thermal epoxy. Single-component, no pot-life limits. Low-viscosity flowable, thixotropic across structural geometries. Multi-reflow compatible, 13 ppm ultra-low CTE, high bond strength margin.

SC6218 20W Thermal Epoxy — High-Tg 195°C, Long-Term Anti-Aging, High-Strength, Low-CTE 28 ppm
SC6218 20W thermal epoxy. Tg 195°C, 190°C/1800h aging zero decay. CTE 28 ppm, 22 MPa bond. Single-component, heat-cure. Bonds metal/ceramic/glass/plating.

SC6114 4.5W Thermal Epoxy — High-Strength, High-Temp, Single-Component Heat-Cure Rigid Adhesive
Heat-cure thermal adhesive. High-temp 280°C, shock-resistant, insulating, reflow-compatible. 4.5 W/m·K, single-component, no pot-life limits.