SC6920 8 W High-Thermal Gel — Non-Curing, Insulating, Low Thermal Resistance, Single-Component
Thermal gel series, 4–11 W/m·K. Single-component & two-component. Non-curing — no powdering, no bleed over lifetime. 0.04 °C/W, insulating, V0 flame-retardant.
Automotive heat-dissipation components, telecom modules, data centers, power components and compute chips — gap filling and thermal conduction.
- Thermal Resistance
- 0.04 °C/W
- Temperature Range
- −40 °C–240 °C
- Cure Condition
- Non-curing
- Viscosity @ 25 °C
- Paste
SCITEO Rigorous Standards: Qualified under GJB 150 environmental reliability testing by Zhenhua, CETC, and CAC, delivering mission-critical reliability.
Engineered as high-reliability domestic qualified alternatives for semiconductor and defense manufacturing clusters across Shanghai Zhangjiang, Xi'an, Chengdu, and Wuxi.
Specifications Don't Match Your Operating Conditions?
Only the baseline series is shown here. SCITEO's undisclosed archive holds formulations engineered for extreme environments. Contact us — our application engineers will match you precisely.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating conditions.
Automotive Thermal Potting
Telecom Module Potting
Data Center Power Potting
Application Engineer FAQ
A structured brief from SCITEO covering physical properties, application standards, and related specifications.
What do different colors mean?
Color has no effect on thermal or mechanical performance. Gray, red, blue, and white options support fast visual identification and model differentiation on the production line.
Why non-curing?
Soft and compliant, it adapts to compression and cushions sensitive components. Interfacial wetting stays stable over service life without dry-out, and open time is generous for rework; it offers no bond strength.
Request Technical Documentation or Consult an Application Engineer
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