Precision Molecular Engineering
SC6112 37W Thermal Epoxy — High-Strength, Single-Component, Insulating, Low-CTE 13 ppm, Anti-Aging
37W thermal epoxy. Single-component, no pot-life limits. Low viscosity, thixotropic. Multi-reflow compatible, 13 ppm ultra-low CTE, high bond strength margin.
Novel semiconductors, military sensors, compute chips, power devices — bonding, thermal, insulation, sealing & filling.
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
Thermal conductance for quantum chips
Thermal conduction of IGBT modules
Thermally conductive bonding of power chips
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
Key bonding advantages?
CTE 13 ppm is extremely low — far below advanced packaging spec adhesives. 32 MPa ultra-high bond strength provides ample margin for complex conditions.
Viscosity and aging?
At 37W ultra-high thermal, viscosity remains flowable with thixotropic geometry compatibility. Heat aging: 190°C 500h+ continuous.
Request TDS or Consult Application Engineer
Receive full Technical Data Sheets (TDS), Safety Data Sheets (SDS), and customized formulations. Please provide accurate information for verification.
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Long-term 400°C+ potting. 2.5 W/m·K thermal, insulating, acid/alkali/solvent resistant, dense fill, boil-proof with no delamination, zero high-temp outgassing.
SC6218 20W Thermal Epoxy — High-Tg 195°C, Long-Term Anti-Aging, High-Strength, Low-CTE 28 ppm
SC6218 20W thermal epoxy. Tg 195°C, 190°C/1800h aging zero decay. CTE 28 ppm, 22 MPa bond. Single-component, heat-cure. Bonds metal/ceramic/glass/plating.
SC6219 60W Thermal+Conductive Epoxy — Single-Component, High Bond, Low-CTE, Low Resistivity
Ultra-high thermal+conductive epoxy. 60 W/m·K, 25 ppm low-CTE, 0.000006 Ω·cm ultra-low resistivity. High bond, heat-cure. Bonds metal/ceramic/glass/platings. Dispensable & printable.