SC6112 5 W Thermal Epoxy — High-Strength, Single-Component, Insulating, Low-CTE 13 ppm, Anti-Aging
5 W/m·K thermal epoxy. Single-component, no pot-life limits. Low-viscosity, flowable and thixotropic across varied structural geometries. Multi-reflow compatible, 13 ppm ultra-low CTE, high-modulus with ample bond-strength margin. Dispensable & printable. 1000 thermal cycles (−40 to 125 °C): 92% shear retention; damp-heat 1000 h (85 °C / 85% RH): 90% shear retention.
Advanced semiconductors, military sensors, compute chips and power devices — bonding, thermal conduction, insulation, sealing and filling.
- Shear Strength
- 32 MPa (etched Al)
- Temperature Range
- −40 °C–280 °C
- Cure Condition
- 120 °C / 30 min
- Viscosity @ 25 °C
- 15000 mPa·s
SCITEO Rigorous Standards: Qualified under GJB 150 environmental reliability testing by Zhenhua, CETC, and CAC, delivering mission-critical reliability.
Engineered as high-reliability domestic qualified alternatives for semiconductor and defense manufacturing clusters across Shanghai Zhangjiang, Xi'an, Chengdu, and Wuxi.
Specifications Don't Match Your Operating Conditions?
Only the baseline series is shown here. SCITEO's undisclosed archive holds formulations engineered for extreme environments. Contact us — our application engineers will match you precisely.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating conditions.
Photonic Quantum Chip Packaging
IGBT Module Thermal Packaging
High-Power Module Heat Transfer
Application Engineer FAQ
A structured brief from SCITEO covering physical properties, application standards, and related specifications.
Key bonding advantages?
At 13 ppm/°C, SC6112's CTE is best-in-class for advanced-packaging adhesives, providing ample interfacial reliability margin, alongside 32 MPa ultra-high shear strength for complex duty cycles.
Viscosity and aging?
Despite 5 W/m·K conduction, SC6112 stays flowable with custom lower-viscosity options; thixotropic behavior suits varied geometries. Performance is stable beyond 500 h of continuous aging at 190 °C.
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Heat-cure thermal adhesive. High-temp 280 °C, shock-resistant, insulating, reflow-compatible. 4.5 W/m·K, single-component, no pot-life limits. CTE 27 ppm; 500 thermal cycles (−40 to 125 °C): 96% shear retention; heat aging 1000 h at 165 °C: 85% shear retention.
SC6218 20 W Thermal Epoxy — High-Tg 195 °C, Long-Term Anti-Aging, High-Strength, Low-CTE 28 ppm
SC6218 20 W thermal epoxy. Tg 195 °C, 1800 h at 190 °C: 95% shear retention. CTE 28 ppm, 22 MPa bond. Single-component, heat-cure. Bonds metal/ceramic/glass/plating. Dispensable & printable. 500 thermal cycles (−40 to 125 °C): 95% shear retention; damp-heat 1000 h (85 °C / 85% RH): 82% shear retention.
SC6219 60 W Thermal+Conductive Epoxy — Single-Component, High Bond, Low-CTE, Low Resistivity
Ultra-high thermal+conductive epoxy. 60 W/m·K, 25 ppm low-CTE, 0.000006 Ω·cm ultra-low resistivity. High bond, heat-cure. Bonds metal/ceramic/glass/platings. Dispensable & printable. 1000 thermal cycles (−40 to 125 °C): 90% shear retention; damp-heat 1000 h (85 °C / 85% RH): 78% shear retention.