Precision Molecular Engineering
SC6112 5W Thermal Epoxy — High-Strength, Single-Component, Insulating, Low-CTE 13 ppm, Anti-Aging
5W thermal epoxy. Single-component, no pot-life limits. Low-viscosity flowable, thixotropic across structural geometries. Multi-reflow compatible, 13 ppm ultra-low CTE, high bond strength margin.
Novel semiconductors, military sensors, compute chips, power devices — bonding, thermal, insulation, sealing & filling.
- Shear Strength
- 32 MPa
- Temperature Range
- −40 °C–280 °C
- Cure Condition
- 120 °C / 30 min
- Viscosity @ 25 °C
- 15000 mPa·s
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
Specifications Don't Match Your Operating Conditions?
This page displays only the baseline product series. Within SCITEO's undisclosed database, we maintain extensive formulations engineered for extreme environments. Contact us directly — our application experts will deliver a precise match.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
Quantum Chip Bonding
IGBT Module Bonding
Power Chip Bonding
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
Key bonding advantages?
CTE 13 ppm is extremely low — far below advanced packaging spec adhesives. 32 MPa ultra-high bond strength provides ample margin for complex conditions.
Viscosity and aging?
At 5W thermal, viscosity stays flowable with thixotropic geometry compatibility — lower viscosity custom formulations available. Heat aging: 190°C 500h+ continuous.
Request TDS or Consult Application Engineer
Receive product documentation and customized formulations. Please provide accurate information for verification.
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SC633 Long-Term 400°C Potting Compound — Thermal, Insulating, Acid/Alkali-Resistant, Single-Component
Long-term 400°C+ potting. 2.5 W/m·K thermal, insulating, acid/alkali/solvent resistant, dense fill, boil-proof with no delamination, zero high-temp outgassing.
SC6218 20W Thermal Epoxy — High-Tg 195°C, Long-Term Anti-Aging, High-Strength, Low-CTE 28 ppm
SC6218 20W thermal epoxy. Tg 195°C, 190°C/1800h aging zero decay. CTE 28 ppm, 22 MPa bond. Single-component, heat-cure. Bonds metal/ceramic/glass/plating.
SC6219 60W Thermal+Conductive Epoxy — Single-Component, High Bond, Low-CTE, Low Resistivity
Ultra-high thermal+conductive epoxy. 60 W/m·K, 25 ppm low-CTE, 0.000006 Ω·cm ultra-low resistivity. High bond, heat-cure. Bonds metal/ceramic/glass/platings. Dispensable & printable.