Precision Molecular Engineering
SC6219 60W Thermal+Conductive Epoxy — Single-Component, High Bond, Low-CTE, Low Resistivity
Ultra-high thermal+conductive epoxy. 60 W/m·K, 25 ppm low-CTE, 0.000006 Ω·cm ultra-low resistivity. High bond, heat-cure. Bonds metal/ceramic/glass/platings. Dispensable & printable.
Novel semiconductors, compute chips, military lasers, silicon photonics & optoelectronic packaging — bonding, conduction & thermal management.
- Shear Strength
- 22 MPa
- Temperature Range
- −45 °C–280 °C
- Cure Condition
- 150 °C / 30 min
- Viscosity @ 25 °C
- 13000 mPa·s (thixotropic)
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
Specifications Don't Match Your Operating Conditions?
This page displays only the baseline product series. Within SCITEO's undisclosed database, we maintain extensive formulations engineered for extreme environments. Contact us directly — our application experts will deliver a precise match.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
Semiconductor Die Attach
Military Laser Bonding
Optical Packaging
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
CTE performance and aging?
CTE below Tg: 25 ppm — advanced packaging grade. Aging from low CTE: −40–155°C thermal shock 500 cycles, shear retention 95%.
Engineering significance of 60 W/m·K?
High-power chips, laser assemblies, silicon photonics — extreme heat flux density, too precise for sintered-silver cure. SC6219 uses conventional cure for metal-grade thermal conduction at low CTE.
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Long-term 400°C+ potting. 2.5 W/m·K thermal, insulating, acid/alkali/solvent resistant, dense fill, boil-proof with no delamination, zero high-temp outgassing.
SC6218 20W Thermal Epoxy — High-Tg 195°C, Long-Term Anti-Aging, High-Strength, Low-CTE 28 ppm
SC6218 20W thermal epoxy. Tg 195°C, 190°C/1800h aging zero decay. CTE 28 ppm, 22 MPa bond. Single-component, heat-cure. Bonds metal/ceramic/glass/plating.
SC6112 5W Thermal Epoxy — High-Strength, Single-Component, Insulating, Low-CTE 13 ppm, Anti-Aging
5W thermal epoxy. Single-component, no pot-life limits. Low-viscosity flowable, thixotropic across structural geometries. Multi-reflow compatible, 13 ppm ultra-low CTE, high bond strength margin.