SC6219 60 W Thermal+Conductive Epoxy — Single-Component, High Bond, Low-CTE, Low Resistivity
Ultra-high thermal+conductive epoxy. 60 W/m·K, 25 ppm low-CTE, 0.000006 Ω·cm ultra-low resistivity. High bond, heat-cure. Bonds metal/ceramic/glass/platings. Dispensable & printable. 1000 thermal cycles (−40 to 125 °C): 90% shear retention; damp-heat 1000 h (85 °C / 85% RH): 78% shear retention.
Advanced semiconductors, compute chips, military lasers, silicon photonics and optoelectronic packaging — bonding, electrical and thermal conduction.
- Shear Strength
- 22 MPa
- Temperature Range
- −45 °C–280 °C
- Cure Condition
- 150 °C / 30 min
- Viscosity @ 25 °C
- 13000 mPa·s (thixotropic)
SCITEO Rigorous Standards: Qualified under GJB 150 environmental reliability testing by Zhenhua, CETC, and CAC, delivering mission-critical reliability.
Engineered as high-reliability domestic qualified alternatives for semiconductor and defense manufacturing clusters across Shanghai Zhangjiang, Xi'an, Chengdu, and Wuxi.
Specifications Don't Match Your Operating Conditions?
Only the baseline series is shown here. SCITEO's undisclosed archive holds formulations engineered for extreme environments. Contact us — our application engineers will match you precisely.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating conditions.
Semiconductor Die Attach
Military Laser Bonding
Optical Packaging
Application Engineer FAQ
A structured brief from SCITEO covering physical properties, application standards, and related specifications.
CTE performance and aging?
Below its Tg, SC6219 has a 25 ppm/°C CTE, best-in-class for advanced packaging; the resulting aging performance is 95% shear retention after 500 thermal-shock cycles from −40 to 155 °C.
Engineering significance of 60 W/m·K?
High-power chips, laser assemblies, and silicon photonics carry extreme heat flux yet are often too delicate for sintered-silver processing. SC6219 combines 60 W/m·K conduction with low CTE using a conventional cure.
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