Precision Molecular Engineering
SC6960 9W High-Thermal Gel — Anti-Aging, Gap Fill, Sealing, Cryogenic, Insulating, Single-Component PCM
9W thermal PCM. Wide-temp, 1000h+ multi-aging test pass, 0.04°C/W. Single-component, ready-to-use liquid, flowable.
Power modules, sensors, compute chips, data centers, servers — gap filling, thermal & insulation.
- Aging Resistance
- 85/85 1500 h
- Temperature Range
- −55 °C–250 °C
- Thermal Conductivity
- 9 W/m·K
- Viscosity @ 25 °C
- 28000 mPa·s
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
Specifications Don't Match Your Operating Conditions?
This page displays only the baseline product series. Within SCITEO's undisclosed database, we maintain extensive formulations engineered for extreme environments. Contact us directly — our application experts will deliver a precise match.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
Power Module Heat Transfer
Sensor Heat Transfer
Data Center Heat Transfer
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
Bond strength?
SC6960 is a liquid PCM — not for bonding. Gap-fill thermal only. Shear strength ~200 psi, reworkable range.
Key thermal features? Anti-aging strength?
Exceptional aging: 85/85 1500h zero thermal resistance decay. 150°C 1500h zero decay. −55–125°C thermal shock 1000 cycles zero decay.
Request TDS or Consult Application Engineer
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