Precision Molecular Engineering
SC6960 9W High-Thermal Gel — Anti-Aging, Gap Fill, Seal, Cryogenic, Insulating, Single-Component PCM
9W thermal PCM. Wide-temp, 1000h+ multi-aging test pass, 0.04°C/W. Single-component, ready-to-use liquid, flowable.
Power modules, sensors, compute chips, data centers, servers — gap filling, thermal & insulation.
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
Power module thermal conduction
Sensor thermal conduction
Data center thermal conduction
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
Bond strength?
SC6960 is a liquid PCM — not for bonding. Gap-fill thermal only. Shear strength ~200 psi, reworkable range.
Key thermal features? Anti-aging strength?
Exceptional aging: 85/85 1500h zero thermal resistance decay. 150°C 1500h zero decay. −55–125°C thermal shock 1000 cycles zero decay.
Request TDS or Consult Application Engineer
Receive full Technical Data Sheets (TDS), Safety Data Sheets (SDS), and customized formulations. Please provide accurate information for verification.
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37W thermal epoxy. Single-component, no pot-life limits. Low viscosity, thixotropic. Multi-reflow compatible, 13 ppm ultra-low CTE, high bond strength margin.
SC6218 20W Thermal Epoxy — High-Tg 195°C, Long-Term Anti-Aging, High-Strength, Low-CTE 28 ppm
SC6218 20W thermal epoxy. Tg 195°C, 190°C/1800h aging zero decay. CTE 28 ppm, 22 MPa bond. Single-component, heat-cure. Bonds metal/ceramic/glass/plating.
SC6219 60W Thermal+Conductive Epoxy — Single-Component, High Bond, Low-CTE, Low Resistivity
Ultra-high thermal+conductive epoxy. 60 W/m·K, 25 ppm low-CTE, 0.000006 Ω·cm ultra-low resistivity. High bond, heat-cure. Bonds metal/ceramic/glass/platings. Dispensable & printable.