SC6960 9 W High-Thermal Gel — Anti-Aging, Gap Fill, Sealing, Cryogenic, Insulating, Single-Component PCM
9 W thermal PCM. Wide-temp, 1000 h+ multi-aging test pass, 0.04 °C/W. Single-component, ready-to-use liquid, flowable. 2000 h heat aging at 150 °C: no degradation.
Power modules, sensors, compute chips, data centers and servers — gap filling, thermal conduction and insulation.
- Aging Resistance
- 85/85 1500 h
- Temperature Range
- −55 °C–250 °C
- Thermal Conductivity
- 9 W/m·K
- Viscosity @ 25 °C
- 28000 mPa·s
SCITEO Rigorous Standards: Qualified under GJB 150 environmental reliability testing by Zhenhua, CETC, and CAC, delivering mission-critical reliability.
Engineered as high-reliability domestic qualified alternatives for semiconductor and defense manufacturing clusters across Shanghai Zhangjiang, Xi'an, Chengdu, and Wuxi.
Specifications Don't Match Your Operating Conditions?
Only the baseline series is shown here. SCITEO's undisclosed archive holds formulations engineered for extreme environments. Contact us — our application engineers will match you precisely.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating conditions.
Power Module Heat Transfer
Sensor Heat Transfer
Data Center Heat Transfer
Application Engineer FAQ
A structured brief from SCITEO covering physical properties, application standards, and related specifications.
Bond strength?
SC6960 is a liquid phase-change material positioned for thermal gap filling, not structural bonding. Its shear strength of about 1.4 MPa falls in the reworkable range and cleans up easily for re-assembly.
Key thermal features? Anti-aging strength?
Aging performance stands out: under 85/85 damp heat, high-temperature storage, and −55 to 125 °C thermal shock alike, thermal resistance holds at its initial level without powdering or bleed-out.
Request Technical Documentation or Consult an Application Engineer
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