Precision Molecular Engineering
SC6106 Low-Temp Cure Epoxy — 60–80°C Thermal Cure, Low Moisture Absorption, Single-Component Insulating
Single-component, fast low-temp cure. Reflow-compatible, high bond strength, bonds most substrates. Minimum cure temp 55°C.
Heat-sensitive components, chip bonding, sealing, filling & insulation.
- Viscosity @ 25 °C
- 1500–280000 mPa·s
- Temperature Range
- −40 °C–240 °C
- Die Shear Strength
- 22 MPa
- Cure Condition
- 55 °C–80 °C / 15 min
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
Specifications Don't Match Your Operating Conditions?
This page displays only the baseline product series. Within SCITEO's undisclosed database, we maintain extensive formulations engineered for extreme environments. Contact us directly — our application experts will deliver a precise match.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
Optical Packaging
Printer Chip Sealing
FPC Chip Underfill
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
Can cure below 80°C? Risks?
Feasible in theory. Lower temp demands higher formulation precision and stricter process/environment control; defect rates increase. SC6106 at 55°C requires uniform-temperature curing ovens.
Storage & handling requirements?
Ship on dry ice; store at −20°C (vacuum-pack preferred). Thaw at room temp; use within 24 hrs (<25°C).
Request TDS or Consult Application Engineer
Receive product documentation and customized formulations. Please provide accurate information for verification.
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