SC6106 Low-Temp Cure Epoxy — 60–80 °C Thermal Cure, Low Moisture Absorption, Single-Component Insulating
Single-component, fast low-temp cure. Reflow-compatible, high bond strength; bonds ceramics, glass, metals and platings. Minimum cure temperature 55 °C.
Temperature- and heat-sensitive sensors, chips, modules and FPCs — bonding, sealing, filling and insulation.
- Viscosity @ 25 °C
- 1500–280000 mPa·s
- Temperature Range
- −40 °C–240 °C
- Die Shear Strength
- 24 MPa (etched Al)
- Cure Condition
- 55 °C–80 °C / 15 min
SCITEO Rigorous Standards: Qualified under GJB 150 environmental reliability testing by Zhenhua, CETC, and CAC, delivering mission-critical reliability.
Engineered as high-reliability domestic qualified alternatives for semiconductor and defense manufacturing clusters across Shanghai Zhangjiang, Xi'an, Chengdu, and Wuxi.
Specifications Don't Match Your Operating Conditions?
Only the baseline series is shown here. SCITEO's undisclosed archive holds formulations engineered for extreme environments. Contact us — our application engineers will match you precisely.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating conditions.
Camera Module Packaging
Optical Chip Packaging
FPC Chip Underfill
Application Engineer FAQ
A structured brief from SCITEO covering physical properties, application standards, and related specifications.
Can cure below 80 °C? Risks?
Feasible, but lower cure temperatures raise formulation and process-window demands exponentially. SC6106 activates at 55 °C and, with a uniform-temperature oven, delivers a stable 24 MPa die shear.
Storage & handling requirements?
Ship on dry ice and transfer immediately to −20 °C storage; vacuum packing further extends shelf stability. Thaw at room temperature and use within 24 h (<25 °C), discarding any unused material.
Request Technical Documentation or Consult an Application Engineer
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