SC6280 80 °C Low-Temp Cure Conductive Silver — Single-Component, High Bond, Low Resistivity
Conductive silver series. Single-component, low-temp cure, 60 °C minimum. High bond strength, chip-grade, 3.1–4.5 GPa tensile modulus. Dispensable & printable. 500 thermal cycles (−40 to 125 °C): 54% shear retention.
Heat-sensitive components, chips, low-temperature sensors and medical modules — bonding, fixation, thermal and electrical conduction.
- Shear Strength
- 18 MPa
- Tg
- 120 °C
- Cure Condition
- 80 °C / 60 min
- Viscosity @ 25 °C
- 15000 mPa·s
SCITEO Rigorous Standards: Qualified under GJB 150 environmental reliability testing by Zhenhua, CETC, and CAC, delivering mission-critical reliability.
Engineered as high-reliability domestic qualified alternatives for semiconductor and defense manufacturing clusters across Shanghai Zhangjiang, Xi'an, Chengdu, and Wuxi.
Specifications Don't Match Your Operating Conditions?
Only the baseline series is shown here. SCITEO's undisclosed archive holds formulations engineered for extreme environments. Contact us — our application engineers will match you precisely.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating conditions.
Conductive Wafer Bonding
Product & Packaging Display
Power Module Bonding
Application Engineer FAQ
A structured brief from SCITEO covering physical properties, application standards, and related specifications.
Is cure temperature fixed?
No. Cure follows Arrhenius kinetics: higher temperature accelerates the reaction and shortens the required time. SC6280 curing at 120 °C takes about half the time of 80 °C — convert by equivalent degree of cure.
Minimum cure temp? How does it differ from standard conductive adhesives?
The series activates from 60 °C. Rare for a low-temperature system, its Tg exceeds the cure temperature — reaching 120 °C, above most standard conductive adhesives, and suits complex thermal cycling.
Request Technical Documentation or Consult an Application Engineer
Receive product documentation and customized formulations. Please provide accurate information for verification.
Recommended Advanced Materials
Explore more proven SCITEO solutions for other critical application environments to close the loop on microelectronics safety.
SC6219 60 W Thermal+Conductive Epoxy — Single-Component, High Bond, Low-CTE, Low Resistivity
Ultra-high thermal+conductive epoxy. 60 W/m·K, 25 ppm low-CTE, 0.000006 Ω·cm ultra-low resistivity. High bond, heat-cure. Bonds metal/ceramic/glass/platings. Dispensable & printable. 1000 thermal cycles (−40 to 125 °C): 90% shear retention; damp-heat 1000 h (85 °C / 85% RH): 78% shear retention.
SC6900 Sintered Silver — Pressureless, Power Module, High-Temp, High-Strength, Low Resistivity, Anti-Aging
Sintered silver series. Pressured/pressureless, full/partial sinter variants. Ultra-low resistivity, high bond strength, multi-aging test pass. Up to 280 W/m·K thermal. 1000 thermal cycles (−40 to 125 °C): 98% shear retention; damp-heat storage 1000 h (85 °C / 85% RH): 90% shear retention.
SC618 500 °C Conductive Adhesive — Single-Component, Heat-Cure, High-Strength, Low-Resistance Bonding
SC618 500 °C conductive. Single-component, 30 MPa bond, zero outgassing at temperature. Bonds metals, ceramics, glass, quartz and SiC; low water absorption. Acid/alkali/solvent resistant. RT storage, no cold chain. Heat aging 168 h at 500 °C: 70% shear-strength retention.