Precision Molecular Engineering
SC6280 80°C Low-Temp Cure Conductive Silver — Single-Component, High Bond, Low Resistivity
Conductive silver series. Single-component, low-temp cure, 60°C minimum. High bond strength, chip-grade. Dispensable & printable.
Heat-sensitive components, chips, modules — bonding, fixing, thermal & electrical conduction.
- Shear Strength
- 12 MPa
- Tg
- 120 °C
- Cure Condition
- 80 °C / 60 min
- Viscosity @ 25 °C
- 15000 mPa·s
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
Specifications Don't Match Your Operating Conditions?
This page displays only the baseline product series. Within SCITEO's undisclosed database, we maintain extensive formulations engineered for extreme environments. Contact us directly — our application experts will deliver a precise match.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
Conductive Wafer Bonding
Product & Packaging Display
Power Module Bonding
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
Is cure temperature fixed?
No. Higher temp shortens cure time linearly. SC6280 at 120°C cures in half the 80°C time.
Minimum cure temp? How does it differ from standard conductive adhesives?
Minimum 60°C. Despite low-temp cure, Tg is 120°C — higher than many standard conductive adhesives. Suited for complex thermal cycling.
Request TDS or Consult Application Engineer
Receive product documentation and customized formulations. Please provide accurate information for verification.
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SC6900 Sintered Silver — Pressureless, Power Module, High-Temp, High-Strength, Low Resistivity, Anti-Aging
Sintered silver series. Pressured/pressureless, full/partial sinter variants. Ultra-low resistivity, high bond strength, multi-aging test pass. Up to 280 W/m·K thermal.
SC618 500°C Conductive Adhesive — Single-Component, Heat-Cure, High-Strength, Low-Resistance Bonding
SC618 500°C conductive. Single-component, 30 MPa bond, zero outgassing at temp. Bonds metal/ceramic/glass. Acid/alkali/solvent resistant. RT storage, no cold chain.