Precision Molecular Engineering
SC6002 280°C Potting Epoxy — 2.5W Thermal, Low-CTE, Insulating, 30 MPa, Two-Component
Low-viscosity self-leveling, 280°C, 30 MPa bond, 2.5 W/m·K, HB flame-retardant insulating. Low CTE compatible with varied substrates.
Military sensors, power modules, automotive electronics, semiconductor devices — filling, sealing, bonding & insulation.
- Shear Strength
- 30 MPa (etched Al)
- Temperature Range
- −40 °C–280 °C
- Cure Condition
- RT or heat cure
- CTE below Tg
- 23 ppm/°C
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
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High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
Sensor Potting and Filling
Power Module Potting
Automotive Parts Sealing
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
Why does low CTE matter for potting?
CTE is a core semiconductor parameter. Low CTE disperses substrate internal stress, eliminating cracking, tensile failure, and deformation. SC6002 at 23 ppm is advanced packaging grade.
What distinguishes SC6002 from standard potting compounds?
Beyond temperature: 2.5 W/m·K thermal, ample bond strength margin, ultra-low CTE dramatically lifts short-term peak-temp endurance.
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