SC6002 280 °C Potting Epoxy — 2.5 W Thermal, Low-CTE, Insulating, 30 MPa, Two-Component
Low-viscosity self-leveling, 280 °C, 30 MPa bond, 2.5 W/m·K, HB flame-retardant insulating. Low CTE compatible with varied substrates. 1000 thermal cycles (−40 to 125 °C): 88% shear retention; damp-heat 1000 h (85 °C / 85% RH): 80% shear retention.
Military sensors, power modules, intelligent drive modules and semiconductor devices — filling, sealing, bonding and insulation.
- Shear Strength
- 30 MPa (etched Al)
- Temperature Range
- −40 °C–280 °C
- Cure Condition
- RT or heat cure
- CTE below Tg
- 23 ppm/°C
SCITEO Rigorous Standards: Qualified under GJB 150 environmental reliability testing by Zhenhua, CETC, and CAC, delivering mission-critical reliability.
Engineered as high-reliability domestic qualified alternatives for semiconductor and defense manufacturing clusters across Shanghai Zhangjiang, Xi'an, Chengdu, and Wuxi.
Specifications Don't Match Your Operating Conditions?
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High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating conditions.
Sensor Potting and Filling
Power Module Potting
Automotive Parts Sealing
Application Engineer FAQ
A structured brief from SCITEO covering physical properties, application standards, and related specifications.
Why does low CTE matter for potting?
CTE is a core semiconductor parameter: a low value disperses interfacial stress and markedly reduces cracking, tensile failure, and deformation. SC6002 at 23 ppm/°C meets advanced-packaging encapsulant grade.
What distinguishes SC6002 from standard potting compounds?
Beyond temperature resistance: 2.5 W/m·K conduction with ample bond-strength margin, and a 23 ppm/°C low CTE plus ultra-high modulus that raise the practical short-term peak-temperature ceiling.
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