Precision Molecular Engineering
SC6080 Thermal Potting Epoxy — High-Hardness, RT-Cure, Insulating, Low-Viscosity, Two-Component
Thermal series. Two-component, RT-cure. Bonds metal, ceramic, glass. High hardness, impact-resistant, insulating. 2.0 W/m·K, low viscosity.
Power modules, sensors, compute chips, heat-sink assemblies — gap filling, thermal, sealing & insulation.
- Shear Strength
- 18 MPa
- Temperature Range
- −40 °C–180 °C
- Cure Condition
- RT or heat cure
- Viscosity @ 25 °C
- 4500 mPa·s
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
Specifications Don't Match Your Operating Conditions?
This page displays only the baseline product series. Within SCITEO's undisclosed database, we maintain extensive formulations engineered for extreme environments. Contact us directly — our application experts will deliver a precise match.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
Water Cooling Plate Potting
Motor Thermal Potting
Chip Module Thermal Potting
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
Epoxy vs. silicone potting?
Silicone: elastic support, reworkable, high elongation. Epoxy: rigid support, superior mechanical strength, high hardness, non-reworkable.
Is two-component handling cumbersome? What if I need higher temp?
Without automation, two-component requires weighing, mixing, pot-life management — prone to cure anomalies. For higher temp, SCITEO offers 300–500°C thermal adhesives.
Request TDS or Consult Application Engineer
Receive product documentation and customized formulations. Please provide accurate information for verification.
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SC633 Long-Term 400°C Potting Compound — Thermal, Insulating, Acid/Alkali-Resistant, Single-Component
Long-term 400°C+ potting. 2.5 W/m·K thermal, insulating, acid/alkali/solvent resistant, dense fill, boil-proof with no delamination, zero high-temp outgassing.
SC6002 280°C Potting Epoxy — 2.5W Thermal, Low-CTE, Insulating, 30 MPa, Two-Component
Low-viscosity self-leveling, 280°C, 30 MPa bond, 2.5 W/m·K, HB flame-retardant insulating. Low CTE compatible with varied substrates.
SC3960 −70°C Cryogenic Epoxy — Thermal, High/Low-Temp Cycling, 96D Ultra-Hard, Potting & Bonding
SC3960 cryogenic epoxy. −70°C no cracking, Mil-Std pass. 180°C high-temp, 1.5 W/m·K thermal. 96D hardness: 200 MPa compressive, 120 MPa flexural. Bonds military & automotive-grade parts.