Precision Molecular Engineering
SC6080 Thermal Potting Epoxy — High-Hardness, RT-Cure, Insulating, Low-Viscosity, 2K AB
Thermal series. 2K AB, RT-cure. Bonds metal, ceramic, glass. High hardness, impact-resistant, insulating. 2.0 W/m·K, low viscosity.
Power modules, sensors, compute chips, heat-sink assemblies — gap filling, thermal, sealing & insulation.
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
Water-cooling plate potting
Motor thermally conductive potting
Chip module thermal conduction
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
Epoxy vs. silicone potting?
Silicone: elastic support, reworkable, high elongation. Epoxy: rigid support, superior mechanical strength, high hardness, non-reworkable.
Is 2K AB handling cumbersome? What if I need higher temp?
Without automation, 2K requires weighing, mixing, pot-life management — prone to cure anomalies. For higher temp, SCITEO offers 300–500°C thermal adhesives.
Request TDS or Consult Application Engineer
Receive full Technical Data Sheets (TDS), Safety Data Sheets (SDS), and customized formulations. Please provide accurate information for verification.
Recommended Advanced Materials
Explore more SCITEO adhesive formulas for other critical application environments to close the loop on microelectronics safety.
SC633 Long-Term 400°C Potting Compound — Thermal, Insulating, Acid/Alkali-Resistant, Single-Component
Long-term 400°C+ potting. 2.5 W/m·K thermal, insulating, acid/alkali/solvent resistant, dense fill, boil-proof with no delamination, zero high-temp outgassing.
SC6002 280°C Potting Epoxy — 2.5W Thermal, Low-CTE, Insulating, 30 MPa, Two-Component AB
Low-viscosity self-leveling, 280°C, 30 MPa bond, 2.5 W/m·K, HB flame-retardant insulating. Low CTE compatible with varied substrates.
SC3960 −70°C Cryogenic Epoxy — Thermal, High/Low-Temp Cycling, 96D Ultra-Hard, Potting & Bonding
SC3960 cryogenic epoxy. −70°C no cracking, Mil-Std pass. 180°C high-temp, 1.5 W/m·K thermal. 96D hardness: 200 MPa compressive, 120 MPa flexural. Bonds military & automotive-grade parts.