Precision Molecular Engineering
SC6630 300°C Transparent Epoxy — Single-Component, High-Strength, Insulating, Rigid Bonding & Sealing
Transparent single-component, ready-to-use. Heat-cure for high bond strength, insulating, 300°C, multi-reflow resistant. Dispensable & printable.
Semiconductor chips, optical components, co-packaged optics, high-power modules — bonding, sealing, fixing & filling.
- Shear Strength
- 16 MPa
- Temperature Range
- −40 °C–300 °C
- Cure Condition
- 150 °C / 30 min
- Viscosity @ 25 °C
- 200000 mPa·s (hi/lo thix)
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
Specifications Don't Match Your Operating Conditions?
This page displays only the baseline product series. Within SCITEO's undisclosed database, we maintain extensive formulations engineered for extreme environments. Contact us directly — our application experts will deliver a precise match.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
Semiconductor Die Attach
Wafer Bonding Process
Precision Bonding
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
How good is high-temp performance?
Tg 195°C — higher than most pigmented epoxies. Short-term 300°C pass, multi-reflow resistant.
Viscosity and flow?
Hi/lo thixotropy variants. At similar viscosity, thixotropic behavior spans two extremes: one static, one flowable — compatible with diverse geometries.
Request TDS or Consult Application Engineer
Receive product documentation and customized formulations. Please provide accurate information for verification.
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SC6300 High-Temp 300°C Single-Component Epoxy — Insulating, Thermal-Cure, High-Strength Bonding
Single-component, ready-to-use. Heat-cure for high-strength bonding, 84D hardness, shock-resistant, insulating, withstands multiple reflow cycles. Dispensable & printable.
SC609 Flexible High-Transparency PU — Two-Component, RT-Cure, High Elongation, Bonding, Sealing, Anti-Aging
Flexible, high-peel-strength PU. Crystal-clear, high tensile elongation. RT-cure, chemical-resistant, humidity/heat aging. 34 kV/mm dielectric strength. Bonds plastics, glass, metal.
SC6004 90D+ Ultra-Hard Transparent Epoxy — Two-Component, Abrasion-Resistant, Flowable Optical Seal
90D+ ultra-hard transparent. Excellent mechanical strength, abrasion/scratch/impact resistant, long open time. Also available: PU transparent 80D anti-yellowing variant.