峻茂新材料 (SCITEO) - 半导体封装与高阶制造高性能胶供应商
峻茂新材料 (SCITEO) - 半导体封装与高阶制造高性能胶供应商
SC6630 300°C Transparent Epoxy — Single-Component, High-Strength, Insulating, Hard Bond & Seal
SCITEO LAB TRUST100% Lab Tested
DISPENSING HARDWARENordson Syringe
STABILITY PROTECTIONSyringe Vacuum Pack
PACKAGINGPackaging: 30cc/syringe

Precision Molecular Engineering

SC6630 300°C Transparent Epoxy — Single-Component, High-Strength, Insulating, Hard Bond & Seal

Transparent single-component, ready-to-use. Heat-cure for high bond strength, insulating, 300°C, multi-reflow resistant. Dispensable & printable.

Typical Application

Semiconductor chips, optical components, co-packaged optics, high-power modules — bonding, sealing, fixing & filling.

Technical Specifications
Shear Strength16 MPa
Temp Range−40°C – 300°C
Cure Condition150°C / 30 min
Viscosity @25°C200,000 mPa·s (hi/lo thix)
* Multiple specifications are available for this series.
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.

This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.

APPLICATION FIELDS

High Reliability Scenarios

Core positioning and partial application demonstration of this product under complex operating cycles.

SC6630 transparent epoxy for semiconductor die bonding

Semiconductor die attach

SC6630 transparent epoxy for wafer bonding process

Wafer bonding process

SC6630 transparent epoxy for chip module PCB bonding

Precision component bonding

FAQ & RESOLUTIONS

Application Engineer FAQ

SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.

Q

How good is high-temp performance?

A

Tg 195°C — higher than most pigmented epoxies. Short-term 300°C pass, multi-reflow resistant.

Q

Viscosity and flow?

A

Hi/lo thixotropy variants. At similar viscosity, thixotropic behavior spans two extremes: one static, one flowable — compatible with diverse geometries.

SCITEO Application Engineering Support

Request TDS or Consult Application Engineer

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