SC6630 300 °C Transparent Epoxy — Single-Component, High-Strength, Insulating, Rigid Bonding & Sealing
Transparent single-component, ready-to-use. Heat-cure for high bond strength, insulating, 300 °C, multi-reflow resistant. Dispensable & printable. 95% shear retention after 1500 h at 190 °C; 500 thermal cycles (−40 to 125 °C): 80% shear retention; damp-heat 1000 h (85 °C / 85% RH): 72% shear retention.
Semiconductor chips, optical components, optoelectronic co-packaging and high-power modules — bonding, sealing, fixation and filling.
- Shear Strength
- 22 MPa
- Temperature Range
- −40 °C–300 °C
- Cure Condition
- 150 °C / 30 min
- Viscosity @ 25 °C
- 200000 mPa·s (hi/lo thix)
SCITEO Rigorous Standards: Qualified under GJB 150 environmental reliability testing by Zhenhua, CETC, and CAC, delivering mission-critical reliability.
Engineered as high-reliability domestic qualified alternatives for semiconductor and defense manufacturing clusters across Shanghai Zhangjiang, Xi'an, Chengdu, and Wuxi.
Specifications Don't Match Your Operating Conditions?
Only the baseline series is shown here. SCITEO's undisclosed archive holds formulations engineered for extreme environments. Contact us — our application engineers will match you precisely.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating conditions.
Semiconductor Die Attach
Wafer Bonding Process
Precision Bonding
Application Engineer FAQ
A structured brief from SCITEO covering physical properties, application standards, and related specifications.
How good is high-temp performance?
Tg reaches 195 °C, well above conventional epoxy systems. The short-term ceiling is 300 °C, it survives repeated lead-free reflow without cracking, and holds 22 MPa shear strength.
Viscosity and flow?
Two thixotropy grades are offered: at comparable viscosity values the thixotropic behavior spans two extremes — fully static to freely flowable — compatible with dispensing and printing.
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