Precision Molecular Engineering
SC6678 MEMS Sensor Packaging Adhesive — Insulating, Thermal, Conductive, Low-CTE, Bonding & Sealing
MEMS sensor adhesive series. −55–500 °C, 2–60 W thermal, ultra-low resistivity conductive, insulating hermetic, 13 ppm low-CTE drift prevention. Multiple viscosity/thixotropy variants.
MEMS chip sensors — bonding, filling, sealing, conduction, thermal & insulation protection.
- Shear Strength
- 28 MPa
- Temperature Range
- −55 °C–500 °C (selectable)
- Cure Condition
- 120 °C / 30 min
- Thermal Conductivity
- 2–60 W/m·K
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
Specifications Don't Match Your Operating Conditions?
This page displays only the baseline product series. Within SCITEO's undisclosed database, we maintain extensive formulations engineered for extreme environments. Contact us directly — our application experts will deliver a precise match.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
MEMS Chip Bonding
Thermal Sensor Sealing
Micro-Optical Sensor Sealing
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
How does SC6678 handle −55°C to 500°C interfacial cracking?
Full-series CTE locked at 13–30 ppm. Elastic stress-buffer layer formed during extreme thermal cycling. Prevents MEMS microstructure deformation and delamination from CTE mismatch.
High thermal or ultra-low-resistivity conduction for high-power/sensitive MEMS?
0–60 W/m·K multi-tier thermal matching and chip-grade conductive networks. Pressureless die-attach with simultaneous extreme transient thermal dissipation and chip-grade ultra-low resistivity.
Request TDS or Consult Application Engineer
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