SC6678 MEMS Sensor Packaging Adhesive — Insulating, Thermal, Conductive, Low-CTE, Bonding & Sealing
MEMS sensor adhesive series. −55 to 500 °C, 2–60 W/m·K thermal, ultra-low resistivity conductive, hermetic insulation and 13 ppm low-CTE drift control. Multiple viscosity/thixotropy variants.
MEMS chip sensors — bonding, filling, sealing, electrical and thermal conduction, and insulation protection.
- Shear Strength
- 28 MPa
- Temperature Range
- −55 °C–500 °C (selectable)
- Cure Condition
- 120 °C / 30 min
- Thermal Conductivity
- 2–60 W/m·K
SCITEO Rigorous Standards: Qualified under GJB 150 environmental reliability testing by Zhenhua, CETC, and CAC, delivering mission-critical reliability.
Engineered as high-reliability domestic qualified alternatives for semiconductor and defense manufacturing clusters across Shanghai Zhangjiang, Xi'an, Chengdu, and Wuxi.
Specifications Don't Match Your Operating Conditions?
Only the baseline series is shown here. SCITEO's undisclosed archive holds formulations engineered for extreme environments. Contact us — our application engineers will match you precisely.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating conditions.
MEMS Chip Bonding
Thermal Sensor Sealing
Micro-Optical Sensor Sealing
Application Engineer FAQ
A structured brief from SCITEO covering physical properties, application standards, and related specifications.
How does SC6678 prevent interfacial cracking from −55 to 500 °C?
The MEMS series holds CTE precisely within 13–30 ppm/°C. Under severe thermal cycling it forms an elastic stress-buffer layer, markedly suppressing deformation and delamination in MEMS microstructures.
How does SC6678 deliver high conduction or ultra-low resistivity?
SCITEO provides 2–60 W/m·K multi-tier options and chip-grade conductive networks: pressureless die attach delivers transient heat dissipation alongside low-resistivity conduction, ensuring electrical continuity with low drift.
Request Technical Documentation or Consult an Application Engineer
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