Precision Molecular Engineering
SC6707 Chip-Package Underfill Epoxy — Low-CTE, High-Tg, High-Modulus for Advanced Packaging
Chip-grade underfill. CTE <25 ppm, low shrinkage, multiple Tg grades (>150°C). Single-component, fast heat-cure, reworkable. SIP/CSP/Flip-chip compatible. Multiple viscosity/flow/color/temp variants.
Advanced packaging, components requiring precise CTE/Tg control, filling, sealing & bonding.
- CTE below Tg
- 21–40 ppm/°C
- Tg
- 90–155 °C
- Cure Condition
- 150 °C / 10 min
- Viscosity @ 25 °C
- 600–5000 mPa·s
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
Specifications Don't Match Your Operating Conditions?
This page displays only the baseline product series. Within SCITEO's undisclosed database, we maintain extensive formulations engineered for extreme environments. Contact us directly — our application experts will deliver a precise match.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
Optoelectronic Co-Packaging
High-Speed Chip Dispensing
Flip-Chip Dispensing
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
What role does modulus play in packaging? Your values?
Chips are heterogeneous — internal stress is critical. High modulus provides rigid support to redistribute stress. Storage modulus: 8–11+ GPa across product line.
Can underfill cure at low temp? Why high-temp?
Low-temp variants exist but sacrifice performance. Below 100°C cure, Tg, CTE, modulus, and shrinkage cannot meet advanced packaging requirements.
Request TDS or Consult Application Engineer
Receive product documentation and customized formulations. Please provide accurate information for verification.
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