Precision Molecular Engineering
SC6707 Chip-Package Underfill Epoxy — Low-CTE, High-Tg, High-Modulus for Advanced Packaging
Chip-grade underfill. CTE <25 ppm, low shrinkage, multiple Tg grades (>150°C). Single-component, fast heat-cure, reworkable. SIP/CSP/Flip-chip compatible. Multiple viscosity/flow/color/temp variants.
Advanced packaging, components requiring precise CTE/Tg control, filling, sealing & bonding.
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
Optoelectronic advanced packaging
High-speed chip dispensing
Dispensing of flip chip underfill
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
What role does modulus play in packaging? Your values?
Chips are heterogeneous — internal stress is critical. High modulus provides rigid support to redistribute stress. Storage modulus: 8–11+ GPa across product line.
Can underfill cure at low temp? Why high-temp?
Low-temp variants exist but sacrifice performance. Below 100°C cure, Tg, CTE, modulus, and shrinkage cannot meet advanced packaging requirements.
Request TDS or Consult Application Engineer
Receive full Technical Data Sheets (TDS), Safety Data Sheets (SDS), and customized formulations. Please provide accurate information for verification.
Recommended Advanced Materials
Explore more SCITEO adhesive formulas for other critical application environments to close the loop on microelectronics safety.
SC6114 4.5W Thermal Epoxy — High-Strength, High-Temp, Single-Component Heat-Cure Hard Adhesive
Heat-cure thermal adhesive. High-temp 280°C, shock-resistant, insulating, reflow-compatible. 4.5 W/m·K, single-component, no pot-life limits.
SC6300 High-Temp 300°C Single-Component Epoxy — Insulating, Thermal-Cure, High-Strength Bonding
Single-component, ready-to-use. Heat-cure for high-strength bonding, 84D hardness, shock-resistant, insulating, withstands multiple reflow cycles. Dispensable & printable.
SC6301 Temporary Bonding Adhesive — Semiconductor-Grade, 280°C PVD/CVD, Acid/Alkali pH1-13, Peel-Clean Removal
Temporary bonding series. 280°C reflow/PVD/CVD compatible. pH 1–13 acid/alkali 60-min. Low modulus, high elongation, elastic peel-clean removal. Multiple viscosities.