SC6707 Chip-Package Underfill Epoxy — Low-CTE, High-Tg, High-Modulus for Advanced Packaging
Chip-grade underfill. CTE from 13 ppm, low shrinkage, multiple Tg grades (>150 °C). Single-component, fast heat-cure, reworkable. SIP/CSP/Flip-chip compatible. Multiple viscosity/flow/color/temp variants. 1000 thermal cycles (−40 to 125 °C, 150 °C-Tg grade): 88% shear retention.
Advanced packaging, PCBAs, chip modules and components with strict CTE and Tg requirements — underfill, sealing and bonding.
- CTE below Tg
- 13–40 ppm/°C
- Tg
- 90–155 °C
- Cure Condition
- 150 °C / 10 min
- Viscosity @ 25 °C
- 600–5000 mPa·s
SCITEO Rigorous Standards: Qualified under GJB 150 environmental reliability testing by Zhenhua, CETC, and CAC, delivering mission-critical reliability.
Engineered as high-reliability domestic qualified alternatives for semiconductor and defense manufacturing clusters across Shanghai Zhangjiang, Xi'an, Chengdu, and Wuxi.
Specifications Don't Match Your Operating Conditions?
Only the baseline series is shown here. SCITEO's undisclosed archive holds formulations engineered for extreme environments. Contact us — our application engineers will match you precisely.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating conditions.
Optoelectronic Co-Packaging
High-Speed Chip Dispensing
Flip-Chip Dispensing
Application Engineer FAQ
A structured brief from SCITEO covering physical properties, application standards, and related specifications.
What role does modulus play in packaging? Your values?
Chips are heterogeneous stacks where internal stress is critical; high modulus provides rigid support and redistributes that stress. SC6707 covers a storage modulus of 8–13 GPa.
Can underfill cure at low temp? Why high-temp?
Yes, with trade-offs: curing below 100 °C shifts Tg, CTE, modulus, and shrinkage away from advanced-underfill targets. For heat-sensitive parts, specify a dedicated low-temp grade and validate it.
Request Technical Documentation or Consult an Application Engineer
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