Precision Molecular Engineering
SC6301 Temporary Bonding Adhesive — Semiconductor-Grade, 280°C PVD/CVD, Acid/Alkali pH1-13, Peel-Clean Removal
Temporary bonding series. 280°C reflow/PVD/CVD compatible. pH 1–13 acid/alkali 60-min. Low modulus, high elongation, elastic peel-clean removal. Multiple viscosities.
Semiconductor fab, PVD/CVD, wet electroplating, chips, PCBA, wafers — temporary bonding, protection, masking & temporary bonding.
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
Temporary bonding for metal stencil
Temporary bonding for PCBA
Temporary protection for lithography fixtures
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
How does SC6301 protect chip surface patterns during PVD/CVD and strong acid/alkali etching?
High-crosslink-density anti-penetration barrier. Withstands PVD transient high heat with extremely low outgassing. Zero edge undercut in pH 1–13 wet cycles. High-cohesion swell peel-off in specific polar solvents — zero pattern damage.
Why no thermal degradation through multiple reflow passes? How is residue-free removal achieved?
>285°C short-term headroom. After multiple lead-free reflow thermal shocks: no charring or embrittlement. Ultra-high elongation + extremely low peel force — clean tweezer peel-off, zero pin residue.
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