Photonic Quantum Chip Packaging, IGBT Module Thermal Packaging, High-Power Module Heat Transfer
Military Connector Potting, Ceramic Sensor Filling, Military Sensor Potting
Quantum Chip Packaging, Wafer-Level Chip Bonding, MEMS Sensor Bonding
Optoelectronic Co-Packaging, High-Speed Chip Dispensing, Flip-Chip Dispensing
Semiconductor Process Components, High-Temp Sensor Sealing, Optoelectronic Display Chips
High-Power Chip Bonding, Military Laser Bonding, MEMS Chip Sensor Bonding
Semiconductor Process, Semiconductor Equipment, Sensor Thermal Bonding
Power Module Bonding, Heat-Dissipation Component Bonding, Military Component Bonding
High-Power Chip Bonding, Thermal Component Bonding, Power Module Bonding
Sensor Bonding, High-Temperature Limit Test, Military Equipment Sensors
Conductive Wafer Bonding, Product & Packaging Display, Power Module Bonding
Military Sensor Bonding, Automotive Parts Bonding, Military-Standard Component Potting
| 型号 | 耐温范围 | 粘度参数 | 剪切强度 |
|---|---|---|---|
| SC6112 | −40 °C~280 °C | 15000 mPa·s | 32 MPa（刻蚀铝） |
| SC633 | −40 °C~600 °C | 3000 mPa·s | 5 MPa (400 °C) |
| SC6616 | −40 °C~300 °C | 8000~30000 mPa·s | 19 MPa（镀金层） |
| SC6707 | −40 °C~280 °C | 600~5000 mPa·s | 16 MPa / 可返修 |
| SC6300 | −40 °C~300 °C | 280000 mPa·s | 29 MPa（硅芯片） |
| SC6218 | −45 °C~280 °C | 12000 mPa·s | 22 MPa |
| SC616 | −45 °C~1000 °C | 25000 mPa·s | 5 MPa |
| SC626 | −55 °C~280 °C | 8000~80000 mPa·s | 32 MPa |
