Precision Molecular Engineering
SC6724 CMOS Sensor Epoxy — CIS Chip Package, High-Temp, Bonding, Sealing, Anti-Aging
Optical adhesive. Bonds glass, ceramic, Au-plated metal. 280°C multi-reflow compatibility, maintains post-reflow hermeticity. Low water absorption, insulating, multi-viscosity.
CIS chips, CMOS sensors, lens modules, co-packaged optics, sensor assemblies — bonding, sealing, fixing & filling.
- Shear Strength
- 22 MPa
- Temperature Range
- −40 °C–280 °C
- Cure Condition
- 120 °C / 30 min
- Viscosity @ 25 °C
- 80000 mPa·s (hi/lo thix)
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
Specifications Don't Match Your Operating Conditions?
This page displays only the baseline product series. Within SCITEO's undisclosed database, we maintain extensive formulations engineered for extreme environments. Contact us directly — our application experts will deliver a precise match.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
Optical CIS Packaging
Lens Module CMOS Bonding
CIS Sensor Packaging
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
Anti-aging performance?
SC6724 low water absorption. Automotive-grade variants certified at 85/85 500h and 1000h grades.
Why does high-temp tolerance matter?
Some CIS packages undergo multiple reflow passes. Cracking fails hermeticity and moisture tests. Even without reflow, high-temp headroom improves thermal-cycling adaptability.
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Single-component, ready-to-use. Heat-cure for high-strength bonding, 84D hardness, shock-resistant, insulating, withstands multiple reflow cycles. Dispensable & printable.
SC6630 300°C Transparent Epoxy — Single-Component, High-Strength, Insulating, Rigid Bonding & Sealing
Transparent single-component, ready-to-use. Heat-cure for high bond strength, insulating, 300°C, multi-reflow resistant. Dispensable & printable.
SC633 Long-Term 400°C Potting Compound — Thermal, Insulating, Acid/Alkali-Resistant, Single-Component
Long-term 400°C+ potting. 2.5 W/m·K thermal, insulating, acid/alkali/solvent resistant, dense fill, boil-proof with no delamination, zero high-temp outgassing.