SC6724 CMOS Sensor Epoxy — CIS Chip Package, High-Temp, Bonding, Sealing, Anti-Aging
Optical adhesive. Bonds glass, ceramic, Au-plated metal. 280 °C multi-reflow compatibility, maintains post-reflow hermeticity. Low water absorption, insulating, multi-viscosity, 2800 MPa modulus. 500 thermal cycles (−40 to 125 °C): 88% shear retention; damp-heat 1000 h (85 °C / 85% RH): 75% shear retention.
Optical CIS chips, CMOS sensors, lens modules, optoelectronic co-packaging and high-temperature sensors — bonding, sealing, fixation and filling.
- Shear Strength
- 26 MPa
- Temperature Range
- −40 °C–280 °C
- Cure Condition
- 120 °C / 30 min
- Viscosity @ 25 °C
- 80000 mPa·s (hi/lo thix)
SCITEO Rigorous Standards: Qualified under GJB 150 environmental reliability testing by Zhenhua, CETC, and CAC, delivering mission-critical reliability.
Engineered as high-reliability domestic qualified alternatives for semiconductor and defense manufacturing clusters across Shanghai Zhangjiang, Xi'an, Chengdu, and Wuxi.
Specifications Don't Match Your Operating Conditions?
Only the baseline series is shown here. SCITEO's undisclosed archive holds formulations engineered for extreme environments. Contact us — our application engineers will match you precisely.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating conditions.
Optical CIS Packaging
Lens Module CMOS Bonding
CIS Sensor Packaging
Application Engineer FAQ
A structured brief from SCITEO covering physical properties, application standards, and related specifications.
Anti-aging performance?
SC6724 offers low water absorption; for automotive-grade programs with aging requirements, it suits multiple damp-heat grades — 85/85 500 h, 85/85 1000 h and 70/90.
Why does high-temp tolerance matter?
Some CIS packages pass through multiple reflow cycles; cracking would fail hermeticity and moisture testing. Even without reflow, the thermal headroom improves cycling adaptability.
Request Technical Documentation or Consult an Application Engineer
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