Precision Molecular Engineering
SC6724 CMOS Sensor Epoxy — CIS Chip Package, High-Temp, Bond, Seal, Anti-Aging
Optical adhesive. Bonds glass, ceramic, Au-plated metal. 280°C multi-reflow, post-reflow hermeticity pass. Low water absorption, insulating, multi-viscosity.
CIS chips, CMOS sensors, lens modules, co-packaged optics, sensor assemblies — bonding, sealing, fixing & filling.
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
Optical component packaging
High-temperature adhesive demonstration
CIS chip packaging
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
Anti-aging performance?
SC6724 low water absorption. Automotive-grade variants certified at 85/85 500h and 1000h grades.
Why does high-temp tolerance matter?
Some CIS packages undergo multiple reflow passes. Cracking fails hermeticity and moisture tests. Even without reflow, high-temp headroom improves thermal-cycling adaptability.
Request TDS or Consult Application Engineer
Receive full Technical Data Sheets (TDS), Safety Data Sheets (SDS), and customized formulations. Please provide accurate information for verification.
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SC6300 High-Temp 300°C Single-Component Epoxy — Insulating, Thermal-Cure, High-Strength Bonding
Single-component, ready-to-use. Heat-cure for high-strength bonding, 84D hardness, shock-resistant, insulating, withstands multiple reflow cycles. Dispensable & printable.
SC6630 300°C Transparent Epoxy — Single-Component, High-Strength, Insulating, Hard Bond & Seal
Transparent single-component, ready-to-use. Heat-cure for high bond strength, insulating, 300°C, multi-reflow resistant. Dispensable & printable.
SC633 Long-Term 400°C Potting Compound — Thermal, Insulating, Acid/Alkali-Resistant, Single-Component
Long-term 400°C+ potting. 2.5 W/m·K thermal, insulating, acid/alkali/solvent resistant, dense fill, boil-proof with no delamination, zero high-temp outgassing.