Precision Molecular Engineering
SC6390 UV+Thermal Dual-Cure Adhesive — Light/Heat Cure, Anti-Humidity Aging, Bonding, Sealing, Insulating
Dual-cure for complex geometries, low-transmittance substrates. Eliminates shadow-area uncure. Stronger than UV-only. Multiple grades for semiconductor, optical, component needs.
Semiconductor chips, optical components, LiDAR, precision assemblies — bonding, sealing & fixation.
- Shear Strength
- 10 MPa
- Temperature Range
- −40 °C–180 °C
- Cure Condition
- UV 5 s / 80 °C / 10 min
- Viscosity @ 25 °C
- 5000–200000 mPa·s
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
Specifications Don't Match Your Operating Conditions?
This page displays only the baseline product series. Within SCITEO's undisclosed database, we maintain extensive formulations engineered for extreme environments. Contact us directly — our application experts will deliver a precise match.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
Semiconductor Die Attach
Optical Packaging
Image Sensor Sealing
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
Benefits of dual-cure over UV-only?
Stronger bond strength. Compatible with wider range of substrates and geometries. Better anti-aging, hermeticity, fracture resistance, and high-temp performance.
Storage requirements?
Dual-cure requires −20–8°C refrigerated/frozen + light-protected storage — protect from both light contamination and heat degradation.
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