SC6390 UV+Thermal Dual-Cure Adhesive — Light/Heat Cure, Anti-Humidity Aging, Bonding, Sealing, Insulating
Dual-cure for complex geometries, low-transmittance substrates. Eliminates shadow-area uncure. Stronger than UV-only. Multiple grades for semiconductor, optical, component needs.
Semiconductor chips, optical components, LiDAR and precision assemblies — bonding, sealing and fixation.
- Shear Strength
- 16 MPa
- Temperature Range
- −40 °C–180 °C
- Cure Condition
- UV 5 s / 80 °C / 10 min
- Viscosity @ 25 °C
- 5000–200000 mPa·s
SCITEO Rigorous Standards: Qualified under GJB 150 environmental reliability testing by Zhenhua, CETC, and CAC, delivering mission-critical reliability.
Engineered as high-reliability domestic qualified alternatives for semiconductor and defense manufacturing clusters across Shanghai Zhangjiang, Xi'an, Chengdu, and Wuxi.
Specifications Don't Match Your Operating Conditions?
Only the baseline series is shown here. SCITEO's undisclosed archive holds formulations engineered for extreme environments. Contact us — our application engineers will match you precisely.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating conditions.
Semiconductor Die Attach
Optical Packaging
Image Sensor Sealing
Application Engineer FAQ
A structured brief from SCITEO covering physical properties, application standards, and related specifications.
Benefits of dual-cure over UV-only?
Dual UV/heat cure delivers higher bond strength across a wider range of substrates and geometries, and that stronger bond translates into better aging resistance, hermeticity, and fracture resistance.
Storage requirements?
Because it contains a latent thermal initiator, dual-cure is more storage-sensitive than ambient-cure grades: store at −20 to 8 °C in black, light-blocking packaging to prevent photo-initiation and premature heat triggering.
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