Precision Molecular Engineering
SC6390 UV+Thermal Dual-Cure Adhesive — Light/Heat Cure, Anti-Humidity Aging, Bonding, Seal, Insulating
Dual-cure for complex geometries, low-transmittance substrates. Eliminates shadow-area uncure. Stronger than UV-only. Multiple grades for semiconductor, optical, component needs.
Semiconductor chips, optical components, LiDAR, precision assemblies — bonding, sealing & fixation.
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
Semiconductor die attach
Optical component packaging
Image sensor sealing
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
Benefits of dual-cure over UV-only?
Stronger bond strength. Compatible with wider range of substrates and geometries. Better anti-aging, hermeticity, fracture resistance, and high-temp performance.
Storage requirements?
Dual-cure requires −20–8°C refrigerated/frozen + light-protected storage — protect from both light contamination and heat degradation.
Request TDS or Consult Application Engineer
Receive full Technical Data Sheets (TDS), Safety Data Sheets (SDS), and customized formulations. Please provide accurate information for verification.
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SC6106 Low-Temp Cure Epoxy — 60–80°C Thermal Cure, Low Moisture Absorption, Single-Component Insulating
Single-component, fast low-temp cure. Reflow-compatible, high bond strength, bonds most substrates. Minimum cure temp 55°C.
SC6707 Chip-Package Underfill Epoxy — Low-CTE, High-Tg, High-Modulus for Advanced Packaging
Chip-grade underfill. CTE <25 ppm, low shrinkage, multiple Tg grades (>150°C). Single-component, fast heat-cure, reworkable. SIP/CSP/Flip-chip compatible. Multiple viscosity/flow/color/temp variants.
SC6724 CMOS Sensor Epoxy — CIS Chip Package, High-Temp, Bond, Seal, Anti-Aging
Optical adhesive. Bonds glass, ceramic, Au-plated metal. 280°C multi-reflow, post-reflow hermeticity pass. Low water absorption, insulating, multi-viscosity.