Precision Molecular Engineering
SC6210 Ceramic Bonding Epoxy — 1000°C, Thermal, Conductive, Potting, Sealing, Insulating
Multi-solution ceramic adhesives. Temp, thermal, insulating, conductive variants. RT or heat-cure. Hermetic sealing, high-strength bonding, low-shrinkage low-CTE stress control.
Ceramic-based semiconductors, ceramic-based components — bonding, sealing, filling & protection.
- Shear Strength
- 20–32 MPa
- Temperature Range
- −40 °C–1000 °C
- Cure Condition
- RT or heat cure
- Viscosity @ 25 °C
- 1500–200000 mPa·s
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
Specifications Don't Match Your Operating Conditions?
This page displays only the baseline product series. Within SCITEO's undisclosed database, we maintain extensive formulations engineered for extreme environments. Contact us directly — our application experts will deliver a precise match.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
Ceramic Chip Bonding
Ceramic LED Chip Bonding
Precision Bonding
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
What functional properties for ceramic applications?
Beyond high bond strength: conductive (0.000004 Ω·cm), insulating, ultra-high thermal (37 W/m·K), high-temp (300–1000°C).
Why does cracking occur during ceramic bonding?
Two types: adhesive cohesive failure (poor temp/aging resistance) and ceramic substrate fracture (high CTE/shrinkage causing internal tensile stress).
Request TDS or Consult Application Engineer
Receive product documentation and customized formulations. Please provide accurate information for verification.
Recommended Advanced Materials
Explore more SCITEO adhesive formulas for other critical application environments to close the loop on microelectronics safety.
SC6036 85/85 Anti-Aging Adhesive — 1000h Humidity/Heat, Low Outgassing, Insulating, Bonding, Sealing
Anti-aging series. 1000h 85/85 pass. Insulating or conductive variants. Extremely low outgassing, high-strength hermetic bonding. Bonds plastics, glass, metal, ceramic. Multiple viscosities.
SC633 Long-Term 400°C Potting Compound — Thermal, Insulating, Acid/Alkali-Resistant, Single-Component
Long-term 400°C+ potting. 2.5 W/m·K thermal, insulating, acid/alkali/solvent resistant, dense fill, boil-proof with no delamination, zero high-temp outgassing.
SC6112 5W Thermal Epoxy — High-Strength, Single-Component, Insulating, Low-CTE 13 ppm, Anti-Aging
5W thermal epoxy. Single-component, no pot-life limits. Low-viscosity flowable, thixotropic across structural geometries. Multi-reflow compatible, 13 ppm ultra-low CTE, high bond strength margin.