SC6210 Ceramic Bonding Epoxy — 1000 °C, Thermal, Conductive, Potting, Sealing, Insulating
Multi-solution ceramic adhesives. Temp, thermal, insulating, conductive variants. RT or heat-cure. Hermetic sealing, high-strength bonding, low-shrinkage low-CTE stress control.
Ceramic-based semiconductors and ceramic-based components — bonding, sealing, filling and protection.
- Shear Strength
- 20–32 MPa
- Temperature Range
- −40 °C–1000 °C
- Cure Condition
- RT or heat cure
- Viscosity @ 25 °C
- 1500–200000 mPa·s
SCITEO Rigorous Standards: Qualified under GJB 150 environmental reliability testing by Zhenhua, CETC, and CAC, delivering mission-critical reliability.
Engineered as high-reliability domestic qualified alternatives for semiconductor and defense manufacturing clusters across Shanghai Zhangjiang, Xi'an, Chengdu, and Wuxi.
Specifications Don't Match Your Operating Conditions?
Only the baseline series is shown here. SCITEO's undisclosed archive holds formulations engineered for extreme environments. Contact us — our application engineers will match you precisely.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating conditions.
Ceramic Chip Bonding
Ceramic Semiconductor Bonding
Precision Bonding
Application Engineer FAQ
A structured brief from SCITEO covering physical properties, application standards, and related specifications.
What functional properties for ceramic applications?
Beyond high bond strength, SCITEO offers ceramic-substrate options covering conductive (5×10⁻⁵ Ω·cm volume resistivity), insulating, ultra-high thermal (37 W/m·K), and high-temperature (300–1000 °C) functions.
Why does cracking occur during ceramic bonding?
Two failure modes: cohesive cracking of the adhesive, usually from insufficient thermal or aging resistance; and substrate fracture, where CTE or cure shrinkage drives internal stress past the ceramic's tensile limit.
Request Technical Documentation or Consult an Application Engineer
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