Precision Molecular Engineering
SC6036 85/85 Anti-Aging Adhesive — 1000h Humidity/Heat, Low Outgassing, Insulating, Bonding, Sealing
Anti-aging series. 1000h 85/85 pass. Insulating or conductive variants. Extremely low outgassing, high-strength hermetic bonding. Bonds plastics, glass, metal, ceramic. Multiple viscosities.
Novel semiconductors, automotive electronics, military sensors, silicon photonics co-packaging — bonding, sealing, filling & protection.
- Aging Resistance
- 85/85 1000 h
- Temperature Range
- −45 °C–265 °C
- Cure Condition
- 120 °C / 10 min
- Viscosity @ 25 °C
- 800–20000 mPa·s (hi/lo thix)
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
Specifications Don't Match Your Operating Conditions?
This page displays only the baseline product series. Within SCITEO's undisclosed database, we maintain extensive formulations engineered for extreme environments. Contact us directly — our application experts will deliver a precise match.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
LiDAR Component Sealing
Automotive Chip Packaging
Military Sensor Sealing
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
What 85/85 1000h series types exist?
Underfill grade, component conductive grade, RT-cure general grade, chip packaging/sensor sealing heat-cure insulating grade. Diverse viscosity/thixotropy for varied applications.
How does SC6036 achieve 85/85 1000h?
Extreme low-cure-shrinkage internal stress control in crosslink network — eliminates moisture-ingress interfacial stress tearing. Ultra-high ionic purity with near-zero outgassing prevents substrate-level impurity attack.
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