峻茂新材料 (SCITEO) - 半导体封装与高阶制造高性能胶供应商
峻茂新材料 (SCITEO) - 半导体封装与高阶制造高性能胶供应商
SC6036 85/85 Anti-Aging Adhesive — 1000h Humidity/Heat, Low Outgassing, Insulating, Bonding, Seal
SCITEO LAB TRUST100% Lab Tested
DISPENSING HARDWARENordson Syringe
STABILITY PROTECTIONSyringe Vacuum Pack
PACKAGINGPackaging: 30cc/syringe

Precision Molecular Engineering

SC6036 85/85 Anti-Aging Adhesive — 1000h Humidity/Heat, Low Outgassing, Insulating, Bonding, Seal

Anti-aging series. 1000h 85/85 pass. Insulating or conductive variants. Extremely low outgassing, high-strength hermetic bonding. Bonds plastics, glass, metal, ceramic. Multiple viscosities.

Typical Application

Novel semiconductors, automotive electronics, military sensors, silicon photonics co-packaging — bonding, sealing, filling & protection.

Technical Specifications
Aging Resistance85°C/85%RH 1000h
Temp Range−45°C – 265°C
Cure Condition120°C / 10 min
Viscosity @25°C800–20,000 mPa·s (hi/lo thix)
* Multiple specifications are available for this series.
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.

This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.

APPLICATION FIELDS

High Reliability Scenarios

Core positioning and partial application demonstration of this product under complex operating cycles.

SC6036 85/85 anti-aging adhesive for LiDAR assembly bonding & sealing

LiDAR sealing

SC6036 85/85 anti-aging adhesive for automotive-grade chip packaging bonding & sealing

Automotive-grade chip packaging

SC6036 85/85 anti-aging adhesive for military sensor bonding & sealing

Military sensor sealing

FAQ & RESOLUTIONS

Application Engineer FAQ

SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.

Q

What 85/85 1000h series types exist?

A

Underfill grade, component conductive grade, RT-cure general grade, chip packaging/sensor sealing heat-cure insulating grade. Diverse viscosity/thixotropy for varied applications.

Q

How does SC6036 achieve 85/85 1000h?

A

Extreme low-cure-shrinkage internal stress control in crosslink network — eliminates moisture-ingress interfacial stress tearing. Ultra-high ionic purity with near-zero outgassing prevents substrate-level impurity attack.

SCITEO Application Engineering Support

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