SC6036 85/85 Anti-Aging Adhesive — 1000 h Humidity/Heat, Low Outgassing, Insulating, Bonding, Sealing
QUALITY CONTROL100% Lab Tested
DISPENSING SPECNordson Syringe
OUTER PACKAGINGVacuum-Sealed
PACKAGING SPEC30cc/syringe
Permeating the silicon matrix from the unseen

SC6036 85/85 Anti-Aging Adhesive — 1000 h Humidity/Heat, Low Outgassing, Insulating, Bonding, Sealing

Anti-aging series. 1000 h 85/85 pass. Insulating or conductive variants. Extremely low outgassing, high-strength hermetic bonding. Bonds plastics, glass, metal, ceramic. Multiple viscosities. Damp-heat storage 1000 h (85 °C / 85% RH): 98% shear retention.

Typical Application

Advanced semiconductors, automotive-grade electronics, military sensors and silicon-photonics co-packaging — bonding, sealing, filling and protection.

Technical Specifications
Aging Resistance
85/85 1000 h
Temperature Range
−45 °C–265 °C
Cure Condition
120 °C / 10 min
Viscosity @ 25 °C
800–20000 mPa·s (hi/lo thix)
* Multiple specifications are available for this series
SCITEO Rigorous Standards: Qualified under GJB 150 environmental reliability testing by Zhenhua, CETC, and CAC, delivering mission-critical reliability.

Engineered as high-reliability domestic qualified alternatives for semiconductor and defense manufacturing clusters across Shanghai Zhangjiang, Xi'an, Chengdu, and Wuxi.

SCITEO R&D ARCHIVE

Specifications Don't Match Your Operating Conditions?

Only the baseline series is shown here. SCITEO's undisclosed archive holds formulations engineered for extreme environments. Contact us — our application engineers will match you precisely.

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APPLICATION FIELDS

High Reliability Scenarios

Core positioning and partial application demonstration of this product under complex operating conditions.

SCITEO dual-85 anti-aging adhesive for LiDAR component bonding, sealing and fixation

LiDAR Component Sealing

SCITEO dual-85 anti-aging adhesive for automotive-grade chip packaging bonding, sealing and filling

Automotive Chip Packaging

SCITEO dual-85 anti-aging adhesive for military sensor bonding, sealing and fixation

Military Sensor Sealing

FAQ & ENGINEERING ANSWERS

Application Engineer FAQ

A structured brief from SCITEO covering physical properties, application standards, and related specifications.

Q

What 85/85 1000 h series types exist?

A

The range spans underfill, conductive component bonding, ambient-cure general purpose, and heat-cure insulating grades for chip packaging and sensor sealing, with high/low viscosity and thixotropy options.

Q

How does SC6036 achieve 85/85 1000 h?

A

Its crosslink network delivers very low cure shrinkage and internal stress, markedly suppressing interfacial stress tearing from moisture ingress; ultra-high ionic purity and near-zero outgassing avoid impurity attack.

Engineering Support

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