
SC6036 85/85 Anti-Aging Adhesive — 1000 h Humidity/Heat, Low Outgassing, Insulating, Bonding, Sealing
Anti-aging series. 1000 h 85/85 pass. Insulating or conductive variants. Extremely low outgassing, high-strength hermetic bonding. Bonds plastics, glass, metal, ceramic. Multiple viscosities. Damp-heat storage 1000 h (85 °C / 85% RH): 98% shear retention.
Advanced semiconductors, automotive-grade electronics, military sensors and silicon-photonics co-packaging — bonding, sealing, filling and protection.
- Aging Resistance
- 85/85 1000 h
- Temperature Range
- −45 °C–265 °C
- Cure Condition
- 120 °C / 10 min
- Viscosity @ 25 °C
- 800–20000 mPa·s (hi/lo thix)
SCITEO Rigorous Standards: Qualified under GJB 150 environmental reliability testing by Zhenhua, CETC, and CAC, delivering mission-critical reliability.
Engineered as high-reliability domestic qualified alternatives for semiconductor and defense manufacturing clusters across Shanghai Zhangjiang, Xi'an, Chengdu, and Wuxi.
Specifications Don't Match Your Operating Conditions?
Only the baseline series is shown here. SCITEO's undisclosed archive holds formulations engineered for extreme environments. Contact us — our application engineers will match you precisely.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating conditions.

LiDAR Component Sealing

Automotive Chip Packaging

Military Sensor Sealing
Application Engineer FAQ
A structured brief from SCITEO covering physical properties, application standards, and related specifications.
What 85/85 1000 h series types exist?
The range spans underfill, conductive component bonding, ambient-cure general purpose, and heat-cure insulating grades for chip packaging and sensor sealing, with high/low viscosity and thixotropy options.
How does SC6036 achieve 85/85 1000 h?
Its crosslink network delivers very low cure shrinkage and internal stress, markedly suppressing interfacial stress tearing from moisture ingress; ultra-high ionic purity and near-zero outgassing avoid impurity attack.
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