Precision Molecular Engineering
SC6046 Black UV-Cure Adhesive — Light-Blocking, Confidential Fill & Seal, Chip-Level Optical Adhesive
UV-cure series. Jet-black opaque, bonds metal/ceramic/glass/PCB, 85/85 200h aging, optical-grade light blocking, cross-cut test pass.
Chip packaging, optical assemblies, lenses, electronic components — bonding, sealing, filling, light-blocking & confidentiality.
- Shear Strength
- 6 MPa
- Temp Range
- −40°C – 120°C
- Cure Condition
- 5–20 s or UV+thermal
- Viscosity @25°C
- 1,000–150,000 mPa·s
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
Specifications Don't Match Your Operating Conditions?
This page displays only the baseline product series. Within SCITEO's undisclosed database, we maintain extensive formulations engineered for extreme environments. Contact us directly — our application experts will deliver a precise match.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
Chip packaging
Optical lens packaging
Electronic component packaging
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
Anti-aging performance? Test method?
85/85 is a key aging metric. SC6046 tested on Au-plated chip substrate: 85°C/85%RH 200h, shear strength retention 90%.
Optical blocking performance?
SC6046 is not a conventional black adhesive. Optical-grade light blocking requires quantified metrics: R <2, OD >3, RI >1.7, cross-cut test pass.
Request TDS or Consult Application Engineer
Receive product documentation and customized formulations. Please provide accurate information for verification.
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