Precision Molecular Engineering
SC6046 Black UV-Cure Adhesive — Light-Blocking, Confidential Fill & Seal, Chip-Level Optical Adhesive
UV-cure series. Jet-black opaque, bonds metal/ceramic/glass/PCB, 85/85 200h aging, optical-grade light blocking, cross-cut test pass.
Chip packaging, optical assemblies, lenses, electronic components — bonding, sealing, filling, light-blocking & confidentiality.
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
Chip packaging
Optical lens packaging
Electronic component packaging
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
Anti-aging performance? Test method?
85/85 is a key aging metric. SC6046 tested on Au-plated chip substrate: 85°C/85%RH 200h, shear strength retention 90%.
Optical blocking performance?
SC6046 is not ordinary black. Optical-grade blocking requires data: R <2, OD >3, RI >1.7, cross-cut test pass.
Request TDS or Consult Application Engineer
Receive full Technical Data Sheets (TDS), Safety Data Sheets (SDS), and customized formulations. Please provide accurate information for verification.
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SC6020 UV-Cure Chip Packaging Adhesive — Semiconductor Bond, Seal, Fix, Anti-Aging
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SC6106 Low-Temp Cure Epoxy — 60–80°C Thermal Cure, Low Moisture Absorption, Single-Component Insulating
Single-component, fast low-temp cure. Reflow-compatible, high bond strength, bonds most substrates. Minimum cure temp 55°C.