SC6046 Black UV-Cure Adhesive — Light-Blocking, Confidential Fill & Seal, Chip-Level Optical Adhesive
UV-cure series. Jet-black opaque, bonds metal/ceramic/glass/PCB, 85/85 200 h aging, optical-grade light blocking, passes cross-cut adhesion testing.
Chip packaging, optical components, optical lenses and modules — bonding, sealing, filling, light-blocking and confidentiality.
- Shear Strength
- 10 MPa
- Temperature Range
- −40 °C–120 °C
- Cure Condition
- 5–20 s or UV+thermal
- Viscosity @ 25 °C
- 1000–150000 mPa·s
SCITEO Rigorous Standards: Qualified under GJB 150 environmental reliability testing by Zhenhua, CETC, and CAC, delivering mission-critical reliability.
Engineered as high-reliability domestic qualified alternatives for semiconductor and defense manufacturing clusters across Shanghai Zhangjiang, Xi'an, Chengdu, and Wuxi.
Specifications Don't Match Your Operating Conditions?
Only the baseline series is shown here. SCITEO's undisclosed archive holds formulations engineered for extreme environments. Contact us — our application engineers will match you precisely.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating conditions.
Semiconductor Packaging
Optical Component Packaging
Electronics Packaging
Application Engineer FAQ
A structured brief from SCITEO covering physical properties, application standards, and related specifications.
Anti-aging performance? Test method?
The 85/85 test is a key aging metric. Tested on Au-plated chip substrates, SC6046 retains 90% of its shear strength after damp-heat exposure, with no interfacial cracking or delamination.
Optical blocking performance?
SC6046 is not a conventional black adhesive: optical-grade blocking requires quantified data — refractive index (RI) above 1.7, OD > 3 (transmittance < 0.1%) and reflectance R < 2%, verified by cross-cut adhesion testing.
Request Technical Documentation or Consult an Application Engineer
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