Precision Molecular Engineering
SC6020 UV-Cure Chip Packaging Adhesive — Semiconductor Bonding, Sealing, Fixation, Anti-Aging
UV-cure series. Chip & semiconductor packaging protection. Multiple Tg grades, UV rapid cure (seconds) or UV+thermal dual-cure, humidity-resistant.
Semiconductor chips, optical components, precision assembly — bonding, sealing & fixation.
- Shear Strength
- 15 MPa
- Temperature Range
- −20 °C–180 °C
- Cure Condition
- 3–10 s or UV+thermal
- Viscosity @ 25 °C
- 3000–280000 mPa·s
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
Specifications Don't Match Your Operating Conditions?
This page displays only the baseline product series. Within SCITEO's undisclosed database, we maintain extensive formulations engineered for extreme environments. Contact us directly — our application experts will deliver a precise match.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
Semiconductor Die Attach
Optical Packaging
Precision Bonding
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
Is UV cure time fixed?
No. Cure time depends on source wavelength/power, transmittance, distance, substrate, and adhesive energy — must be empirically validated.
UV vs. thermal-cure adhesives?
UV suits heat-sensitive components, extremely fast throughput. For semiconductor packaging, UV-cure overall performance trails thermal-cure epoxies — set realistic specs.
Request TDS or Consult Application Engineer
Receive product documentation and customized formulations. Please provide accurate information for verification.
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