Precision Molecular Engineering
SC6020 UV-Cure Chip Packaging Adhesive — Semiconductor Bond, Seal, Fix, Anti-Aging
UV-cure series. Chip & semiconductor packaging protection. Multiple Tg grades, UV seconds-cure or UV+thermal dual-cure, humidity-resistant.
Semiconductor chips, optical components, precision assembly — bonding, sealing & fixation.
SCITEO Rigorous Standards: Certified via GJB150 testing by Zhenhua, CETC, and CAC, providing reliable support.
This product provides local substitution for Shanghai Zhangjiang High-Tech Park, Xi'an & Chengdu military industrial bases, and Wuxi packaging industrial cluster.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
Semiconductor die attach
Optical component packaging
Precision component bonding
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
Is UV cure time fixed?
No. Cure time depends on source wavelength/power, transmittance, distance, substrate, and adhesive energy — must be empirically validated.
UV vs. thermal-cure adhesives?
UV suits heat-sensitive components, extremely fast throughput. For semiconductor packaging, UV-cure overall performance trails thermal-cure epoxies — set realistic specs.
Request TDS or Consult Application Engineer
Receive full Technical Data Sheets (TDS), Safety Data Sheets (SDS), and customized formulations. Please provide accurate information for verification.
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SC6707 Chip-Package Underfill Epoxy — Low-CTE, High-Tg, High-Modulus for Advanced Packaging
Chip-grade underfill. CTE <25 ppm, low shrinkage, multiple Tg grades (>150°C). Single-component, fast heat-cure, reworkable. SIP/CSP/Flip-chip compatible. Multiple viscosity/flow/color/temp variants.
SC6616 Die-Attach Conductive Silver — High-Strength, High-Tg, Low Resistivity, Thermal-Cure Epoxy
SC66 series single-component conductive silver epoxy. High die-shear strength, high-Tg for aging resistance, chip-grade. Multiple thermal conductivity grades, ultra-low resistivity, low-CTE. Dispensable & printable.
SC6106 Low-Temp Cure Epoxy — 60–80°C Thermal Cure, Low Moisture Absorption, Single-Component Insulating
Single-component, fast low-temp cure. Reflow-compatible, high bond strength, bonds most substrates. Minimum cure temp 55°C.