SC6020 UV-Cure Chip Packaging Adhesive — Semiconductor Bonding, Sealing, Fixation, Anti-Aging
UV-cure series. Chip & semiconductor packaging protection. Multiple Tg grades, UV rapid cure (seconds) or UV+thermal dual-cure, humidity-resistant.
Semiconductor chips, optical components and modules — bonding, sealing and fixation.
- Shear Strength
- 15 MPa
- Temperature Range
- −20 °C–180 °C
- Cure Condition
- 3–10 s or UV+thermal
- Viscosity @ 25 °C
- 3000–280000 mPa·s
SCITEO Rigorous Standards: Qualified under GJB 150 environmental reliability testing by Zhenhua, CETC, and CAC, delivering mission-critical reliability.
Engineered as high-reliability domestic qualified alternatives for semiconductor and defense manufacturing clusters across Shanghai Zhangjiang, Xi'an, Chengdu, and Wuxi.
Specifications Don't Match Your Operating Conditions?
Only the baseline series is shown here. SCITEO's undisclosed archive holds formulations engineered for extreme environments. Contact us — our application engineers will match you precisely.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating conditions.
Communication Module Bonding
Optical Lens-to-Glass Sealing
Chip Corner Bonding
Application Engineer FAQ
A structured brief from SCITEO covering physical properties, application standards, and related specifications.
Is UV cure time fixed?
No. It depends on source wavelength and power, substrate transmittance, irradiation distance, substrate type, and bond-line thickness — and must be validated on the line before being locked into a work standard.
UV vs. thermal-cure adhesives?
UV is built for heat-sensitive components, fixturing in seconds with very high throughput. SCITEO's dual-cure design also cures deep and shadowed zones, so semiconductor packaging still achieves stable bonding and hermeticity.
Request Technical Documentation or Consult an Application Engineer
Receive product documentation and customized formulations. Please provide accurate information for verification.
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Chip-grade underfill. CTE from 13 ppm, low shrinkage, multiple Tg grades (>150 °C). Single-component, fast heat-cure, reworkable. SIP/CSP/Flip-chip compatible. Multiple viscosity/flow/color/temp variants. 1000 thermal cycles (−40 to 125 °C, 150 °C-Tg grade): 88% shear retention.
SC6390 UV+Thermal Dual-Cure Adhesive — Light/Heat Cure, Anti-Humidity Aging, Bonding, Sealing, Insulating
Dual-cure for complex geometries, low-transmittance substrates. Eliminates shadow-area uncure. Stronger than UV-only. Multiple grades for semiconductor, optical, component needs.
SC6106 Low-Temp Cure Epoxy — 60–80 °C Thermal Cure, Low Moisture Absorption, Single-Component Insulating
Single-component, fast low-temp cure. Reflow-compatible, high bond strength; bonds ceramics, glass, metals and platings. Minimum cure temperature 55 °C.