
SC2620 Military Connector Potting Epoxy — Wide-Temp, Mil-Std Cold/Heat Cycling, Flame-Retardant, Insulating
Military connector epoxy. 280 °C reflow multi-pass, −55 °C no cracking. Single-component & two-component variants. Bonds engineering plastics, metal, platings, Teflon. 500 thermal cycles (−40 to 125 °C): 92% shear retention; damp-heat 1000 h (85 °C / 85% RH): 76% shear retention.
Military connectors, data-center harness sockets and automotive connectors — potting, filling, protection and fixation.
- Shear Strength
- 26 MPa (Cu-plated)
- Temperature Range
- −55 °C–280 °C
- Cure Condition
- RT or heat cure
- Viscosity @ 25 °C
- 1500–10000 mPa·s
SCITEO Rigorous Standards: Qualified under GJB 150 environmental reliability testing by Zhenhua, CETC, and CAC, delivering mission-critical reliability.
Engineered as high-reliability domestic qualified alternatives for semiconductor and defense manufacturing clusters across Shanghai Zhangjiang, Xi'an, Chengdu, and Wuxi.
Specifications Don't Match Your Operating Conditions?
Only the baseline series is shown here. SCITEO's undisclosed archive holds formulations engineered for extreme environments. Contact us — our application engineers will match you precisely.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating conditions.

Data Center Harness Potting

Vehicle Connector Potting

Aerospace Connector Potting
Application Engineer FAQ
A structured brief from SCITEO covering physical properties, application standards, and related specifications.
Single or two-component?
The SC2620 series covers both: two-component (ambient or heat cure, with mixing and pot-life limits) and one-component (no mixing, heat-cure triggered). Select by line conditions.
What hard-to-bond substrates?
Military Cu plating and PTFE defeat most adhesives and then fail cold/thermal shock. SC2620 bonds PTFE when used with SCITEO's specified surface activation process, without creep or corrosion.
Request Technical Documentation or Consult an Application Engineer
Receive product documentation and customized formulations. Please provide accurate information for verification.
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SC633 Long-Term 400 °C Potting Compound — Thermal, Insulating, Acid/Alkali-Resistant, Single-Component
Long-term 400 °C+ potting. 2.5 W/m·K thermal, insulating, acid/alkali/solvent resistant, dense, void-free fill, boil-proof with no delamination, zero high-temp outgassing. Heat aging 360 h at 400 °C: 96% shear-strength retention.

SC6300 High-Temp 300 °C Single-Component Epoxy — Insulating, Thermal-Cure, High-Strength Bonding
Single-component, ready-to-use. Heat-cure for high-strength bonding, 84D hardness, shock-resistant, insulating, withstands multiple reflow cycles. Dispensable & printable. 3.9 GPa modulus; heat aging 500 h at 250 °C: 92% shear retention; 500 thermal cycles (−40 to 125 °C): 85% shear retention.