{"name":"峻茂新材料 (SCITEO) — 半导体封装先进材料","short_name":"SCITEO","description":"峻茂新材料(SCITEO)深耕耐高温胶、高导热胶、导电胶、耐低温胶、环氧树脂胶、半导体封装胶及Underfill。通过GJB 150A/JESD22-A101/AEC-Q100可靠性验证，为半导体封装与军工制造提供底层材料方案。","start_url":"/","scope":"/","display":"standalone","background_color":"#FFFFFF","theme_color":"#005A9E","icons":[{"src":"/192icon.png","sizes":"192x192","type":"image/png","purpose":"any"},{"src":"/icon.png","sizes":"512x512","type":"image/png","purpose":"any"},{"src":"/apple-touch-icon.png","sizes":"180x180","type":"image/png","purpose":"any"}]}